XC6SLX150-3FG484I

The XC6SLX150-3FG484I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) from AMD designed for designs that require high logic capacity, on-chip memory, and a large I/O count. It combines 147,443 logic elements with approximately 4.94 Mbits of embedded memory and up to 338 I/Os to support complex digital logic and interfacing needs.

Specified for industrial operation and RoHS compliant, this surface-mount FPGA offers a compact 484-BBGA/484-FBGA (23×23) package and operates over a 1.14 V to 1.26 V supply range and an ambient temperature range of −40 °C to 100 °C.

Key Features

• Core and Capacity  147,443 logic elements provide substantial programmable logic resources for complex designs.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support buffers, FIFOs, and local storage without external memory.
• I/O Density  Up to 338 general-purpose I/Os to accommodate broad interfacing requirements with peripherals and external components.
• Power  Operates from a 1.14 V to 1.26 V core supply range.
• Package & Mounting  Available in a 484-BBGA package (supplier device package: 484-FBGA, 23×23) for surface-mount PCB assembly.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control Systems  Use the FPGA's logic capacity and I/O density for real-time control, sensor interfacing, and protocol bridging in industrial equipment.
• High-Density Logic Implementation  Implement complex state machines, custom datapaths, and parallel processing logic leveraging the large logic element count.
• Embedded Memory Acceleration  On-chip RAM supports local buffering and temporary data storage for streaming, packet processing, or signal-conditioning functions.
• I/O-Intensive Systems  Leverage 338 I/Os for multi-channel connectivity, front-end interfaces, or dense peripheral integration.

Unique Advantages

• High Logic Density: 147,443 logic elements enable integration of large functions and consolidation of multiple discrete devices.
• On-Chip Memory Resources: Approximately 4.94 Mbits of embedded RAM reduce dependence on external memory and lower BOM complexity.
• Extensive I/O Count: 338 I/Os provide flexibility for complex interfacing and multiple parallel connections.
• Industrial Temperature Range: −40 °C to 100 °C operation supports deployment in harsh or temperature-variable environments.
• Compact BGA Package: 484-BBGA (484-FBGA, 23×23) balances pin count and PCB area for space-constrained designs.
• Regulatory Compliance: RoHS status ensures alignment with common environmental compliance requirements.

Why Choose XC6SLX150-3FG484I?

The XC6SLX150-3FG484I positions itself for designs that demand substantial programmable logic, meaningful on-chip memory, and a large number of I/Os within an industrial temperature envelope. Its combination of 147,443 logic elements, approximately 4.94 Mbits of embedded RAM, and 338 I/Os makes it suitable for consolidating complex digital functions and reducing external component count.

Manufactured by AMD and offered in a compact 484-BBGA surface-mount package with RoHS compliance, this FPGA is aimed at engineers and procurement teams seeking a high-capacity, industrial-grade programmable device for robust embedded and control applications.

If you would like pricing, availability, or to request a quote for the XC6SLX150-3FG484I, please submit a quote request or contact our sales support team for further assistance.