XC6SLX100-L1FGG484I

The XC6SLX100-L1FGG484I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD designed for industrial applications. It provides a large pool of reconfigurable logic, substantial on-chip memory, and a high I/O count in a compact ball grid array package for dense board-level integration.

This device is specified for a supply voltage range of 1.14 V to 1.26 V and an operating temperature range of -40 °C to 100 °C, making it suitable for industrial-grade designs that require robust environmental performance.

Key Features

• Core Logic — 101,261 logic elements provide significant programmable logic capacity for implementing complex digital functions and custom hardware acceleration.
• Embedded Memory — Approximately 4.94 Mbits of on-chip RAM (4,939,776 bits) to support buffering, lookup tables, and data storage within the FPGA fabric.
• I/O Density — 326 user I/O pins to support a wide range of external interfaces and parallel/peripheral connections.
• Power Supply — Specified operating supply voltage from 1.14 V to 1.26 V for core logic operation.
• Package and Mounting — 484-BBGA package (supplier device package: 484-FBGA, 23×23) with surface-mount mounting for high-density PCB layouts.
• Operating Conditions — Industrial-grade device rated for -40 °C to 100 °C operation and RoHS compliant for regulatory alignment.

Typical Applications

• Industrial Control Systems — Implement custom control logic, I/O aggregation, and deterministic interfacing in industrial equipment with the device’s industrial temperature rating and high I/O count.
• Embedded Acceleration — Use the large logic capacity and on-chip RAM to offload compute-intensive tasks and accelerate specific algorithms in embedded systems.
• Protocol Bridging and Interface Glue — Leverage 326 I/Os to bridge multiple interfaces or create custom protocol converters and interface logic on a single device.

Unique Advantages

• High Logic Capacity: 101,261 logic elements enable complex, multi-function designs without external ASICs for many applications.
• Substantial Embedded Memory: Approximately 4.94 Mbits of on-chip RAM reduce external memory needs and simplify board design.
• Large I/O Count: 326 I/Os provide flexibility for connecting sensors, peripherals, and multiple interface buses directly to the FPGA.
• Industrial Temperature Range: Rated from -40 °C to 100 °C to meet environmental requirements for industrial deployments.
• Compact BGA Package: 484-BBGA (484-FBGA, 23×23) supports high-density PCB integration while maintaining surface-mount assembly compatibility.
• RoHS Compliance: Conforms to RoHS requirements for environmentally responsible product designs.

Why Choose XC6SLX100-L1FGG484I?

The XC6SLX100-L1FGG484I delivers a balanced combination of high programmable logic capacity, ample on-chip memory, and extensive I/O in a compact BGA package tailored for industrial-grade applications. Its specification for a wide operating temperature range and a tightly defined core supply voltage makes it suitable for engineers designing robust, long-lived systems that require reconfigurable hardware.

This Spartan®-6 LX FPGA is aimed at teams needing scalable logic resources and board-level density, enabling consolidation of multiple functions into a single device to reduce BOM complexity and improve system integration.

Request a quote or submit an inquiry to obtain pricing and availability for the XC6SLX100-L1FGG484I and to discuss how it can fit into your next industrial or embedded project.