XC6SLX100-L1FG484I

The XC6SLX100-L1FG484I is a Spartan®-6 LX field programmable gate array (FPGA) offered in a 484-ball BGA package. It delivers a combination of substantial logic capacity, on-chip memory, and a high I/O count for designs that require dense digital integration and flexible I/O routing.

Designed for industrial-grade environments, the device supports a wide operating temperature range and a narrow core voltage range, enabling consistent operation across temperature extremes while maintaining compact, surface-mount packaging.

Key Features

• Core Logic  Approximately 101,261 logic elements for implementing custom digital functions and complex finite-state machines.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
• I/O Capacity  326 general-purpose I/Os to accommodate multiple peripheral interfaces, bus connections, and custom signaling requirements.
• Power  Core voltage supply specified at 1.14 V to 1.26 V, enabling defined power planning for system designers.
• Package & Mounting  484-BBGA package (supplier device package: 484-FBGA, 23×23) with surface-mount construction for compact board-level integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to support demanding thermal environments.
• Regulatory Compliance  RoHS compliant to meet environmental and manufacturing requirements.

Typical Applications

• Custom digital logic and prototyping  Leverage the device’s large logic element count and embedded memory for implementing and iterating complex digital designs and prototypes.
• High-density I/O interfacing  Use the 326 I/Os for aggregating multiple peripheral interfaces, custom protocol conversion, and signal routing within compact systems.
• Industrial control and monitoring  Industrial-grade rating and wide operating temperature range make the device suitable for control electronics and monitoring equipment operating in harsh environments.

Unique Advantages

• High logic capacity: The approximately 101,261 logic elements allow implementation of sizeable combinational and sequential logic without external ASICs.
• On-chip memory for efficient data handling: Nearly 4.94 Mbits of embedded RAM reduce reliance on external memory for buffering and local storage.
• Extensive I/O resources: 326 I/Os enable flexible connectivity across multiple interfaces and subsystem boundaries, simplifying board-level integration.
• Industrial operating range: Rated from −40 °C to 100 °C to support deployments in thermally challenging environments.
• Compact BGA footprint: 484-ball BGA (23×23) surface-mount package conserves PCB area while providing robust signal and thermal performance.
• RoHS compliant: Meets environmental directives for lead-free assembly and manufacturing.

Why Choose XC6SLX100-L1FG484I?

The XC6SLX100-L1FG484I couples substantial logic density and embedded memory with a high I/O count and industrial temperature capability, making it a practical choice for engineers seeking a balanced FPGA for complex digital integration. Its defined core voltage range and compact 484-BBGA package simplify system power design and PCB integration.

This device is suited to designs that require scalable logic resources, significant on-chip RAM, and robust I/O connectivity while operating across a wide temperature range. It provides long-term value through a combination of integration, predictable thermal performance, and compliance with RoHS standards.

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