XC6SLX100-3FGG484C

The XC6SLX100-3FGG484C is a Spartan®-6 LX field programmable gate array (FPGA) in a 484-ball BGA package designed for commercial applications. It provides a large on-chip resource set—over 101,000 logic elements and approximately 4.94 Mbits of embedded memory—together with 326 general-purpose I/Os for configurable digital designs.

This surface-mount FPGA operates from a core supply range of 1.14 V to 1.26 V and is specified for commercial temperature operation from 0°C to 85°C. It is RoHS compliant and targeted at customers who need a programmable, high-density logic fabric in a compact 484-BBGA / 484-FBGA (23×23) footprint.

Key Features

• Core Logic  Provides 101,261 logic elements to implement complex combinational and sequential logic functions.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support data buffering, FIFOs, and embedded storage.
• I/O Capacity  326 user I/Os for interfacing to external devices, buses, and peripherals.
• Power  Core voltage supply range of 1.14 V to 1.26 V for the device core power domain.
• Package & Mounting  484-ball BGA package (Package Case: 484-BBGA; Supplier Device Package: 484-FBGA (23×23)), surface-mount mount type for compact board designs.
• Operating Conditions & Grade  Commercial grade with an operating temperature range of 0°C to 85°C and RoHS compliance for environmental requirements.

Typical Applications

• Commercial Embedded Systems  Use the device’s 101,261 logic elements and 326 I/Os to implement custom digital logic and peripheral interfaces in commercial products.
• Data Buffering and Packet Processing  Approximately 4.94 Mbits of embedded memory enable on-chip buffering and packet handling for mid-density data paths.
• High-Density I/O Aggregation  326 I/Os allow aggregation and conditioning of multiple signals for control, monitoring, or interface bridging in compact designs.

Unique Advantages

• High Logic Density: 101,261 logic elements give designers headroom to implement complex state machines, custom datapaths, and glue logic on a single device.
• Substantial On-Chip Memory: Approximately 4.94 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Ample I/O Count: 326 user I/Os simplify board-level routing by consolidating multiple interfaces into one FPGA footprint.
• Compact Package: 484-ball BGA in a 23×23 supplier footprint supports high-density PCB integration while maintaining a surface-mount assembly process.
• Commercial Temperature Grade: Rated for 0°C to 85°C operation to match typical commercial product environments and deployment scenarios.
• RoHS Compliant: Meets common environmental regulations for lead-free manufacturing.

Why Choose XC6SLX100-3FGG484C?

The XC6SLX100-3FGG484C positions itself as a high-density, commercially graded Spartan®-6 LX FPGA suitable for designers needing substantial logic capacity, significant on-chip memory, and a large I/O count in a compact BGA package. Its core voltage range, surface-mount BGA footprint, and RoHS compliance make it a practical choice for a variety of commercial embedded projects.

This device is suited to engineering teams building scalable, programmable logic solutions where integration of logic, memory, and I/O into a single component reduces board complexity and BOM count while supporting commercial operating conditions.

If you would like pricing, availability, or a formal quote for XC6SLX100-3FGG484C, request a quote or contact sales to start the procurement process.