XC6SLX4-L1CSG225C

The XC6SLX4-L1CSG225C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC supplied in a 225-LFBGA (13×13) CSPBGA package. It provides a balance of configurable logic, embedded memory, and I/O density for programmable logic designs.

With 3,840 logic elements, approximately 0.22 Mbits of on-chip RAM, 132 user I/O pins, and a compact BGA footprint, this commercial-grade device supports mid-density integration in space-constrained surface-mount applications while operating from a 1.14 V to 1.26 V core supply and a 0 °C to 85 °C ambient range.

Key Features

• Core Architecture Spartan®-6 LX FPGA architecture providing 3,840 logic elements for configurable digital logic implementations.
• Logic Blocks (CLBs) 300 configurable logic blocks (CLBs) to implement combinational and sequential logic structures.
• Embedded Memory Approximately 0.22 Mbits (221,184 bits) of on-chip RAM for buffering, FIFOs, and small data stores.
• Input/Output 132 user I/O pins to support multiple parallel interfaces and external peripherals.
• Package & Mounting 225-LFBGA, CSPBGA package (225-CSPBGA, 13×13) designed for surface-mount assembly in compact board designs.
• Power Core voltage supply range of 1.14 V to 1.26 V to match low-voltage system architectures.
• Operating Range Commercial-grade operating temperature of 0 °C to 85 °C suitable for many consumer and industrial environments.
• Regulatory Status RoHS compliant.

Typical Applications

• Custom digital logic — Implement glue logic, protocol translators, and user-defined state machines using 3,840 logic elements and 300 CLBs.
• Prototyping and development — Use the FPGA’s reprogrammability and on-chip RAM for iterative design and verification in compact hardware platforms.
• Interface bridging — Leverage 132 I/O pins to connect and adapt multiple peripheral interfaces in a single BGA package.
• Low- to mid-density embedded control — Deploy the device in control and monitoring applications that require moderate logic capacity and on-board memory within a surface-mount form factor.

Unique Advantages

• Right-sized logic capacity: 3,840 logic elements and 300 CLBs give designers a mid-density programmable fabric suitable for many custom logic needs without excess overhead.
• On-chip memory availability: Approximately 0.22 Mbits of embedded RAM enables local buffering and small data storage without external memory.
• Compact BGA packaging: The 225-LFBGA (13×13) CSPBGA package supports high I/O density in a space-efficient, surface-mount footprint.
• Ample I/O count: 132 user I/O pins provide flexibility to interface with multiple peripherals and parallel buses.
• Commercial-grade readiness: Specified 0 °C to 85 °C operating range and RoHS compliance for broad deployment in commercial applications.
• Low-voltage core support: Narrow core supply window (1.14 V to 1.26 V) for designs with defined low-voltage power rails.

Why Choose XC6SLX4-L1CSG225C?

The XC6SLX4-L1CSG225C positions itself as a mid-density, reprogrammable solution that combines a compact BGA package with a balanced mix of logic elements, embedded RAM, and I/O capacity. Its specification set addresses designs that require moderate programmable logic, local memory, and a significant number of I/O pins within a surface-mount form factor.

Engineers and procurement teams targeting commercial-grade, space-efficient FPGA solutions will find this part suitable for applications that need reconfigurability, modest memory, and board-level integration in a 225-LFBGA package backed by RoHS compliance.

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