XC6SLX45-2CSG324C

IC FPGA 218 I/O 324CSBGA
Part Description

Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 218 2138112 43661 324-LFBGA, CSPBGA

Quantity 156 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package324-CSPBGA (15x15)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-LFBGA, CSPBGANumber of I/O218Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3411Number of Logic Elements/Cells43661
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2138112

Overview of XC6SLX45-2CSG324C – Spartan®-6 LX FPGA, 324-CSPBGA (15×15)

The XC6SLX45-2CSG324C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) from AMD packaged in a 324‑CSPBGA (15×15) surface-mount package. It delivers a balanced combination of programmable logic, embedded memory, and I/O capacity for commercial-grade digital designs.

With 43,661 logic elements, approximately 2.14 Mbits of on-chip RAM, and 218 I/O pins, this device is suited to mid-density logic implementations where integration, predictable power, and defined operating conditions matter.

Key Features

  • Core Logic  43,661 logic elements (LEs) provide substantial programmable logic capacity for complex combinational and sequential designs.
  • Configurable Logic Blocks (CLBs)  3,411 CLBs to structure logic resources and implement custom datapaths and control logic.
  • Embedded Memory  Approximately 2.14 Mbits of on-chip RAM for buffering, FIFOs, and small embedded datasets without external memory.
  • I/O Density  218 user I/O pins in the 324‑CSPBGA package to support a wide range of peripheral interfaces and board-level connectivity.
  • Power  Specified core supply range of 1.14 V to 1.26 V to match system power-rail designs and enable deterministic power planning.
  • Package & Mounting  324‑LFBGA / 324‑CSPBGA (15×15) surface-mount package for compact board integration and reliable solder mounting.
  • Operating Range  Commercial-grade operating temperature range of 0 °C to 85 °C for standard environmental conditions.
  • Regulatory  RoHS compliant, supporting lead‑free assembly and regulatory requirements for many commercial products.

Typical Applications

  • Logic‑intensive system prototyping  Use the device's 43,661 logic elements and 3,411 CLBs to implement and validate complex digital architectures on prototype and pre-production boards.
  • Embedded memory buffering  Approximately 2.14 Mbits of on-chip RAM enables on-device buffering and small data-store functions without immediate external memory dependency.
  • High‑pin-count interface bridging  218 I/O pins provide the connectivity needed for bridging multiple peripheral interfaces and I/O domains on compact PCBs.

Unique Advantages

  • Substantial programmable capacity: 43,661 logic elements and 3,411 CLBs allow significant on-chip implementation of custom logic and control functions, reducing reliance on external ASICs.
  • On-chip memory for streamlined designs: Approximately 2.14 Mbits of embedded RAM supports buffering and local data storage, simplifying system-level memory architecture.
  • High I/O count in a compact package: 218 I/Os in a 324‑CSPBGA (15×15) footprint enable dense connectivity on space-constrained boards.
  • Predictable power envelope: A defined core supply range of 1.14 V to 1.26 V aids in power-supply design and thermal planning for commercial applications.
  • Commercial temperature rating: Rated for 0 °C to 85 °C, suitable for standard commercial deployments where that environmental range is required.
  • RoHS compliance: Facilitates lead-free assembly and aligns with common environmental requirements in commercial product manufacturing.

Why Choose XC6SLX45-2CSG324C?

The XC6SLX45-2CSG324C positions itself as a capable mid-density Spartan‑6 LX FPGA that balances programmable logic, embedded memory, and substantial I/O in a compact 324‑CSPBGA package. Its commercial-grade ratings and defined power and temperature specs make it appropriate for development and production designs operating within standard environmental limits.

This device is well suited to customers seeking a commercially rated FPGA solution with clear logic and memory resources, a high pin count for board-level integration, and RoHS compliance for modern manufacturing workflows.

Request a quote or submit an inquiry to receive pricing and availability for the XC6SLX45-2CSG324C. Our team can provide lead-time information and help qualify the device for your project requirements.

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