XC6SLX45-2CSG324I

IC FPGA 218 I/O 324CSBGA
Part Description

Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 218 2138112 43661 324-LFBGA, CSPBGA

Quantity 629 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package324-CSPBGA (15x15)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case324-LFBGA, CSPBGANumber of I/O218Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3411Number of Logic Elements/Cells43661
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2138112

Overview of XC6SLX45-2CSG324I – Spartan®-6 LX FPGA, 324-LFBGA, Industrial

The XC6SLX45-2CSG324I is a Spartan®-6 LX field programmable gate array (FPGA) in a 324-pin LFBGA/CSPBGA package designed for industrial applications. It integrates substantial programmable logic, embedded RAM, and a large I/O count in a compact surface-mount package, with supply and thermal characteristics suitable for industrial deployment.

Key Features

  • Programmable Logic — Contains 43,661 logic elements to implement combinational and sequential logic, state machines, and custom hardware accelerators.
  • Embedded Memory — Approximately 2.14 Mbits of on-chip RAM for data buffering, FIFOs, and small lookup tables.
  • I/O Capacity — 218 user I/O pins to support multiple peripheral interfaces and system interconnects in a single device.
  • Power — Core voltage supply range from 1.14 V to 1.26 V to match system power architectures.
  • Package & Mounting — 324-LFBGA (324-CSPBGA, 15 × 15) surface-mount package for compact board integration.
  • Temperature & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
  • Compliance — RoHS compliant for environmental and regulatory alignment.

Unique Advantages

  • Substantial logic capacity: 43,661 logic elements provide the resources needed for mid-range FPGA designs without external logic expansion.
  • Embedded memory on-chip: Approximately 2.14 Mbits of RAM reduces reliance on external memory for buffering and small-data storage.
  • High I/O count: 218 I/Os enable integration of multiple interfaces and signal domains directly on the FPGA.
  • Industrial temperature support: −40 °C to 100 °C operating range supports deployment in industrial environments.
  • Compact BGA footprint: 324-CSPBGA (15 × 15) package balances board space efficiency with I/O density for surface-mount assembly.
  • Low-voltage core operation: 1.14–1.26 V supply supports modern power architectures and efficient core power delivery.

Why Choose XC6SLX45-2CSG324I?

The XC6SLX45-2CSG324I offers a balanced combination of logic density, embedded memory, and I/O capacity in an industrial-grade FPGA package. Its specifications make it well suited for designers who need a compact, RoHS-compliant programmable device that operates across a wide industrial temperature range and fits into surface-mount PCB assemblies.

This device targets projects that require scalable logic and on-chip memory with robust environmental tolerance, providing a practical foundation for mid-range custom hardware implementations.

Request a quote or contact sales to discuss availability, pricing, and how the XC6SLX45-2CSG324I can fit your design requirements.

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