XC6SLX45-2FG484I

The XC6SLX45-2FG484I is a Spartan®-6 LX field programmable gate array (FPGA) IC from AMD, supplied in a 484-BBGA package. It delivers a substantial amount of programmable logic and on-chip memory along with extensive I/O capability in a surface-mount form factor.

This device is specified for industrial temperature operation and a low-voltage core supply, making it suitable for designs that require up to 43,661 logic elements, approximately 2.138 Mbits of embedded memory, and up to 316 I/O connections.

Key Features

• Logic Capacity — Provides 43,661 logic elements to implement complex digital logic and custom architectures.
• Embedded Memory — Approximately 2.138 Mbits of on-chip RAM for buffering, state storage, and local data processing.
• I/O Density — Up to 316 I/O pins to support a wide range of peripheral and interface connections.
• Package — 484-BBGA (supplier device package: 484-FBGA, 23×23) for compact, high-density board placement.
• Power — Core voltage supply range of 1.14 V to 1.26 V to match low-voltage system domains.
• Temperature Rating — Industrial operating range from −40°C to 100°C for deployment in temperature-challenging environments.
• Mounting — Surface mount package suitable for modern PCB assembly processes.
• Compliance — RoHS compliant.

Typical Applications

• Industrial control systems — Use the device’s industrial temperature rating and abundant logic/I/O to implement control, monitoring, and interfacing functions.
• Embedded processing and glue logic — Leverage the 43,661 logic elements and available on-chip RAM for custom protocol handling and data manipulation close to sensors and peripherals.
• High-density I/O aggregation — Employ up to 316 I/O pins to consolidate multiple interfaces and simplify board-level routing in space-constrained designs.

Unique Advantages

• High logic integration: 43,661 logic elements enable consolidation of multiple functions into a single programmable device, reducing BOM complexity.
• Integrated on-chip memory: Approximately 2.138 Mbits of RAM supports localized buffering and state retention without external memory.
• Extensive I/O capability: 316 I/O pins provide flexibility for connecting sensors, peripherals, and communication interfaces directly to the FPGA.
• Industrial temperature range: Rated for −40°C to 100°C to support deployment in harsh or temperature-variable environments.
• Compact BGA package: 484-ball FBGA (23×23) offers a small footprint for space-constrained PCBs while maintaining signal density.
• Low-voltage core: 1.14 V to 1.26 V supply range aligns with modern low-voltage system domains to optimize power integration.

Why Choose XC6SLX45-2FG484I?

The XC6SLX45-2FG484I positions itself as a robust programmable logic option where substantial logic density, embedded memory, and a high I/O count are required within an industrial temperature envelope. Its combination of logic elements, on-chip RAM, and compact 484-BBGA packaging provides a balance of integration and board-level efficiency.

This device is suited for engineers and system designers building industrial and embedded systems that need scalable programmable logic, reliable temperature performance, and RoHS compliance. Detailed technical specifications are documented in the manufacturer's datasheet.

Request a quote or submit your requirements to get pricing and availability for the XC6SLX45-2FG484I.