XC6SLX45-2FG676I

The XC6SLX45-2FG676I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) from AMD, delivered in a 676-ball BGA package for surface-mount assembly. It provides a mid-range programmable logic fabric with defined counts for logic elements, on-chip memory and I/O suitable for industrial electronics designs.

Designed for applications that require a balance of logic capacity, embedded memory and flexible I/O, this industrial-grade device operates over a wide temperature range and a specified core voltage rail, enabling deployment in demanding environments.

Key Features

• Core Logic — 43,661 logic elements for implementing custom digital logic, state machines and data-path functions.
• Embedded Memory — 2,138,112 bits of on-chip RAM (approximately 2.14 Mbits) for buffering, FIFOs and small data storage.
• I/O Capacity — 358 user I/Os to support multiple parallel interfaces, sensor arrays and peripheral connectivity.
• Power — Specified core voltage supply range of 1.14 V to 1.26 V for the FPGA core.
• Package & Mounting — 676-ball FBGA package (27 × 27 mm footprint) in a surface-mount form factor for compact board-level integration.
• Temperature & Grade — Industrial grade device rated for operation from −40 °C to 100 °C.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Deterministic logic and I/O capacity for machine control, PLC add-ons or custom control modules operating across industrial temperature ranges.
• Embedded Systems — On-board programmable logic for protocol bridging, pre-processing or glue logic in compact embedded platforms.
• Communications Interfaces — Allocate logic and memory to implement parallel interfaces, custom timing, or peripheral aggregation using the device’s large I/O count.
• Test & Measurement — Implement signal conditioning, data aggregation and timing-critical measurement functions where on-chip RAM and logic density are required.

Unique Advantages

• Substantial Logic Capacity: 43,661 logic elements allow complex custom logic and moderate parallelism without external programmable logic devices.
• Significant On‑Chip Memory: Approximately 2.14 Mbits of embedded RAM reduces dependence on external memory for buffering and small data stores.
• High I/O Count: 358 user I/Os enable direct interfacing to multiple sensors, peripherals or parallel buses, simplifying board-level design.
• Industrial Ready: Rated for −40 °C to 100 °C and classified as industrial grade, supporting deployments in temperature-challenging environments.
• Compact, Surface-Mount Package: 676-FBGA (27 × 27 mm) provides a high-density solution for space-constrained PCBs while maintaining robust signal routing options.
• Controlled Core Supply: Defined core voltage range (1.14 V–1.26 V) for predictable power and timing behavior in system designs.

Why Choose XC6SLX45-2FG676I?

The XC6SLX45-2FG676I delivers a balanced combination of logic density, embedded memory and a large I/O count in a compact industrial-grade BGA package. Its specified operating voltage and temperature range make it suitable for engineered solutions that require predictable electrical and environmental performance.

This AMD Spartan®-6 LX FPGA is well suited for engineers designing industrial control modules, embedded systems, interface bridges and test instrumentation that need on-chip resources to reduce BOM complexity while maintaining board-level compactness and robustness.

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