XC6SLX45-2FGG484I

The XC6SLX45-2FGG484I is a Spartan®-6 LX field programmable gate array (FPGA) in a 484-ball BGA package designed for industrial applications. It provides a balance of logic capacity, embedded memory, and I/O density in a surface-mount 23×23 484-FBGA footprint.

With 43,661 logic elements and approximately 2.14 Mbits of on-chip RAM, this device targets designs that require flexible digital logic, significant embedded memory, and a broad set of I/O while operating across an industrial temperature range.

Key Features

• Logic Capacity — 43,661 logic elements provide substantial programmable fabric for custom logic, datapath implementation, and glue logic integration.
• Configurable Logic Blocks (CLBs) — 3,411 CLBs for implementing combinational and sequential logic structures.
• Embedded Memory — Approximately 2.14 Mbits of total on-chip RAM to support buffering, on-chip data storage, and memory-mapped logic.
• I/O Density — 316 I/O pins to accommodate multiple interfaces, peripheral connections, and system-level signaling requirements.
• Power Supply — Core voltage range of 1.14 V to 1.26 V for compatible power-rail design and integration.
• Package and Mounting — 484-BBGA package (supplier device package: 484-FBGA, 23×23) optimized for surface-mount PCB assembly.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for temperature-challenging environments.
• RoHS Compliant — Conforms to RoHS environmental requirements.

Typical Applications

• Industrial Control — Leverages industrial temperature rating and broad I/O count for control logic, sensor interfacing, and factory automation tasks.
• Embedded Processing and Memory-Intensive Logic — Uses approximately 2.14 Mbits of on-chip RAM and abundant logic elements for buffering, data manipulation, and custom processing functions.
• High-Density I/O Systems — 316 I/O pins support boards that require multiple interfaces, parallel buses, or numerous peripheral connections.

Unique Advantages

• Substantial Logic Resources: 43,661 logic elements enable complex custom logic implementations without immediate need for external CPLDs or microcontrollers.
• Integrated On-Chip Memory: Approximately 2.14 Mbits of RAM reduces dependency on external memory for many buffering and storage needs, simplifying PCB layout.
• High I/O Count: 316 configurable I/Os provide flexibility to connect multiple sensors, actuators, and communication interfaces directly to the FPGA.
• Industrial Temperature Range: Operation from −40 °C to 100 °C supports deployment in thermally demanding environments.
• BGA Surface-Mount Package: The 484-ball FBGA (23×23) package offers a compact, high-density footprint suitable for modern PCB assembly processes.
• RoHS Compliance: Environmentally compliant materials align with common electronics manufacturing requirements.

Why Choose XC6SLX45-2FGG484I?

The XC6SLX45-2FGG484I positions itself as a robust, industrial-grade FPGA option where a combination of ample logic elements, embedded memory, and extensive I/O is required. Its package and power characteristics make it suitable for compact, surface-mount designs that must operate across a wide temperature range.

Designers and engineers seeking a programmable fabric that balances capacity and system-level integration will find this device appropriate for applications that demand on-chip memory and flexible connectivity while adhering to industrial environmental requirements.

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