XC6SLX45-2FGG676I

The XC6SLX45-2FGG676I is an industrial-grade Field Programmable Gate Array (FPGA) in a 676-BGA package designed for configurable digital logic implementations. It delivers a balance of on-chip logic, embedded memory, and a high I/O count for applications that require flexible, reprogrammable hardware.

With a supply voltage range of 1.14 V to 1.26 V and an extended operating temperature range from -40 °C to 100 °C, this device is targeted at systems that demand robust operation across wide environmental conditions while providing substantial logic and I/O resources.

Key Features

• Logic Capacity  Provides 43,661 logic elements suitable for implementing complex custom logic and state machines.
• Embedded Memory  Includes approximately 2.14 Mbits of on-chip RAM for data buffering, FIFOs, and small on-chip storage.
• I/O Resources  358 I/O pins to support extensive external interfacing and parallel connectivity.
• Core Power  Operates from a core voltage supply range of 1.14 V to 1.26 V to match system power domains.
• Package  Available in a 676-ball BGA (676-FBGA, 27 × 27 mm) package for high-pin-count, compact board designs.
• Industrial Temperature Grade  Rated for operation from -40 °C to 100 °C for deployment in demanding environments.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• Industrial Control  Use the device for custom control logic, motion-control interfaces, and industrial communication endpoints that require wide temperature operation and significant I/O.
• Data Acquisition and Signal Processing  Leverage the device’s logic density and on-chip RAM for preprocessing, buffering, and custom data-path implementations.
• Interface Bridging  High I/O count supports protocol bridging and signal aggregation between multiple peripherals and subsystems.

Unique Advantages

• Substantial Logic Resources: 43,661 logic elements enable complex custom logic without external ASIC development.
• On-Chip Memory: Approximately 2.14 Mbits of embedded RAM reduces dependence on external memory for many buffering and FIFO needs.
• High I/O Count: 358 I/Os provide flexibility for multi-channel interfacing and parallel connections.
• Industrial Robustness: Rated for -40 °C to 100 °C operation to support systems exposed to wide environmental ranges.
• Compact High-Pin Package: 676-BGA (676-FBGA, 27 × 27) offers high pin density in a space-efficient footprint for complex boards.
• Standards-Ready Manufacturing: RoHS-compliant production supports environmentally conscious designs.

Why Choose XC6SLX45-2FGG676I?

The XC6SLX45-2FGG676I provides a practical combination of logic capacity, embedded memory, and extensive I/O in an industrial-temperature FPGA package. Its specified core voltage range and 676-BGA footprint make it suitable for designs that require compact, reconfigurable hardware with reliable operation across wide temperature ranges.

This device is well suited for engineers and system designers building industrial control systems, data acquisition equipment, and multi-interface bridging solutions who need on-board programmable logic with plentiful I/O and on-chip RAM to simplify system architecture and reduce external component count.

Request a quote or submit an inquiry to receive pricing and availability information for the XC6SLX45-2FGG676I. Our team will provide the details you need to move your design forward.