XC6SLX45-3CSG324C

The XC6SLX45-3CSG324C is a Spartan®-6 LX field programmable gate array in a 324-ball LFBGA/CSPBGA package from AMD. It provides a programmable logic fabric with substantial on-chip memory and a high I/O count for commercial embedded designs.

With 43,661 logic elements, approximately 2.14 Mbits of embedded memory and up to 218 I/O, this device is intended for commercial applications that require configurable logic, integrated RAM, and a compact surface-mount package while operating within a 0 °C to 85 °C temperature range.

Key Features

• Logic Capacity — 43,661 logic elements to implement complex programmable logic and custom digital functions.
• Configurable Logic Blocks — 3,411 CLBs available for building combinational and sequential logic structures.
• Embedded Memory — Approximately 2.14 Mbits of on-chip RAM to support buffering, registers, and small data stores.
• I/O Resources — Up to 218 user I/O pins for interfacing to peripherals, sensors, and external memory.
• Power Supply — Operates from a core voltage supply range of 1.14 V to 1.26 V.
• Package and Mounting — 324-CSPBGA (15 × 15) 324-LFBGA surface-mount package for compact board-level integration.
• Operating Range — Commercial grade operation from 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic, protocol handling, and glue logic in compact, surface-mount designs.
• High-Density I/O Interfaces — Manage multiple external interfaces and sensors using up to 218 user I/O pins.
• On-Chip Data Buffering — Use the approximately 2.14 Mbits of embedded RAM for buffering and temporary data storage in data-paths and control logic.

Unique Advantages

• High Logic Density: 43,661 logic elements provide the capacity to consolidate multiple functions into a single programmable device, reducing overall component count.
• Substantial Embedded Memory: Approximately 2.14 Mbits of on-chip RAM lowers dependence on external memory for mid-sized buffering needs.
• Generous I/O Count: 218 I/O pins enable flexible system integration with sensors, peripherals, and communication interfaces.
• Compact, Surface-Mount Package: The 324-CSPBGA (15 × 15) package supports high-density PCB layouts and automated assembly.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to match a wide range of commercial applications and environments.
• Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XC6SLX45-3CSG324C?

The XC6SLX45-3CSG324C from AMD's Spartan®-6 LX family delivers a balance of logic capacity, embedded memory, and I/O density in a compact surface-mount package for commercial designs. Its combination of 43,661 logic elements, approximately 2.14 Mbits of on-chip RAM, and 218 I/O makes it suitable for projects that require significant programmable logic and interface flexibility while maintaining a small board footprint.

This device is well suited for engineers and procurement teams targeting commercial embedded applications that need scalable programmable resources, compact packaging, and RoHS-compliant components backed by a known FPGA family.

Request a quote or submit a purchase inquiry today to check availability and pricing for the XC6SLX45-3CSG324C.