XC6SLX45-2FGG484CES

The XC6SLX45-2FGG484CES is a Spartan®-6 LX family field programmable gate array from AMD, delivered in a 484-ball BGA package. It provides a commercial-grade programmable-logic solution with a substantial logic capacity, on-chip memory, and a high I/O count for system integration and interface tasks.

Designed for commercial applications, this surface-mount FPGA targets designs that require programmable logic, abundant I/O, and controlled power rails within a standard commercial temperature range.

Key Features

• Logic Capacity — 43,661 logic elements to implement combinational and sequential logic for medium to high-density designs.
• Embedded Memory — Approximately 2.14 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• I/O — 316 I/O pins to support multiple parallel interfaces and dense external connectivity.
• Core Supply Voltage — Core voltage range of 1.14 V to 1.26 V for the device core power rail.
• Package and Mounting — 484-BBGA package (supplier device package: 484-FBGA, 23×23); surface-mount form factor suited for compact board designs.
• Operating Range — Commercial operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental conformance.

Typical Applications

• Commercial Embedded Systems — Deploy custom logic and protocol handling where a commercial-grade FPGA with broad I/O is required.
• Interface and Bridge Functions — Use the 316 I/O pins to implement parallel interfaces, protocol translation, and glue logic between subsystems.
• Prototyping and Development — Implement and iterate custom digital designs that need substantial logic and local RAM capacity.

Unique Advantages

• High Logic Density: 43,661 logic elements provide the capacity to implement complex state machines, datapaths, and custom accelerators without external logic expansion.
• On-Chip Memory: Approximately 2.14 Mbits of embedded RAM reduces reliance on external memory for buffering and local storage, simplifying BOM and board layout.
• Generous I/O Count: 316 I/O pins enable connection to multiple peripherals and parallel buses, improving system integration flexibility.
• Compact BGA Packaging: 484-ball BGA (484-FBGA, 23×23) offers a high-pin-count, space-efficient footprint for dense board designs.
• Commercial-Grade Qualification: Rated for 0 °C to 85 °C operation and RoHS compliant, suitable for a wide range of commercial applications.
• Controlled Core Power: Narrow core supply range (1.14 V–1.26 V) aids predictable power design and voltage regulation choices.

Why Choose XC6SLX45-2FGG484CES?

The XC6SLX45-2FGG484CES combines substantial logic capacity, on-chip RAM, and a high I/O count in a compact 484-BBGA surface-mount package from AMD. Its specifications make it well suited for commercial embedded designs that require programmable logic integration, multiple interfaces, and local data buffering while operating within a standard commercial temperature range.

This part is appropriate for engineers and procurement teams looking for a commercially rated FPGA offering a balance of logic resources, embedded memory, and dense I/O in a compact form factor, backed by AMD as the manufacturer.

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