XC6SLX45-2FGG676C

The XC6SLX45-2FGG676C is a Spartan®-6 LX field programmable gate array (FPGA) from AMD, provided in a 676-ball fine-pitch BGA package. It delivers a programmable logic fabric with a high I/O count and embedded memory suitable for commercial embedded designs that require customizable digital logic and dense interfacing.

Key Features

• Logic Capacity — Contains 43,661 logic elements to implement custom digital functions and control logic.
• Embedded Memory — Approximately 2.1 Mbits of on-chip RAM for buffering, state storage, and local data processing.
• I/O Density — 358 I/O pins to support extensive external interfacing and board-level connectivity.
• Package and Mounting — 676‑BGA (supplier package: 676‑FBGA, 27×27 mm) supplied in a surface-mount form factor for compact board integration.
• Power — Core voltage supply range from 1.14 V to 1.26 V to match system power rails and regulator choices.
• Operating Range — Commercial-grade operation from 0 °C to 85 °C.
• Compliance — RoHS compliant, supporting environmental regulations for lead-free assemblies.

Typical Applications

• Custom Digital Logic — Use the programmable fabric for implementing application-specific processing, control logic, and glue logic.
• I/O-Intensive Interfaces — High pin count enables bridging and protocol handling across multiple peripherals and external devices.
• Embedded System Integration — On-chip memory and logic capacity support local data handling and control tasks within commercial embedded products.

Unique Advantages

• High Logic Density: 43,661 logic elements provide substantial capacity for complex logic and state machines without external components.
• Significant On-Chip Memory: Approximately 2.1 Mbits of embedded RAM reduces external memory needs for many buffering and data-storage functions.
• Extensive Connectivity: 358 I/O pins give designers flexibility to connect multiple interfaces and peripherals directly to the device.
• Compact, High-Pin Package: 676‑FBGA (27×27 mm) offers high pin-count in a compact footprint suitable for space-constrained boards.
• Low-Voltage Core: 1.14–1.26 V supply supports integration with modern low-voltage power architectures.
• Regulatory Compliance: RoHS compliance facilitates use in lead-free manufacturing processes.

Why Choose XC6SLX45-2FGG676C?

The XC6SLX45-2FGG676C positions itself as a commercially graded FPGA option that balances sizable programmable logic, embedded memory, and a high I/O count in a compact 676‑BGA package. It is suited for designers seeking on-chip resources to consolidate digital functions, manage multiple interfaces, and reduce external component count.

With a defined core voltage range and a commercial operating temperature window, this device is aimed at standard commercial embedded designs where configurable logic, on-chip RAM, and dense I/O are required. Its RoHS compliance and surface-mount package support streamlined manufacturing and assembly workflows.

Request a quote or submit a pricing inquiry today to evaluate the XC6SLX45-2FGG676C for your next commercial FPGA design.