XC6SLX45-3CSG324I

IC FPGA 218 I/O 324CSBGA
Part Description

Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 218 2138112 43661 324-LFBGA, CSPBGA

Quantity 487 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package324-CSPBGA (15x15)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case324-LFBGA, CSPBGANumber of I/O218Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3411Number of Logic Elements/Cells43661
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2138112

Overview of XC6SLX45-3CSG324I – Spartan®-6 LX FPGA, 43,661 logic elements, 324-LFBGA

The XC6SLX45-3CSG324I is a Spartan®-6 LX field programmable gate array (FPGA) in a 324‑LFBGA (324‑CSPBGA, 15×15) package. It delivers a mid-range logic capacity with a combination of on‑chip memory and a high I/O count for use in industrial applications requiring reprogrammable logic.

With 43,661 logic elements, approximately 2.14 Mbits of embedded memory, and 218 user I/Os, this device is suited for designs that require substantial logic resources, flexible I/O connectivity, and operation across a wide industrial temperature range.

Key Features

  • Core Logic 43,661 logic elements organized into 3,411 CLBs provide the programmable logic fabric for implementing custom digital functions and control logic.
  • Embedded Memory Approximately 2.14 Mbits of on‑chip RAM (2,138,112 total RAM bits) for data buffering, FIFOs, and on‑chip storage.
  • I/O 218 user I/O pins to support a variety of external interfaces, sensors, and peripherals.
  • Package 324‑LFBGA, supplied as 324‑CSPBGA (15×15), providing a compact BGA footprint for board integration.
  • Power Core supply range of 1.14 V to 1.26 V for the FPGA core power rail.
  • Temperature & Grade Industrial grade device rated for operation from −40 °C to 100 °C, suitable for industrial environments.
  • Environmental Compliance RoHS compliant.

Unique Advantages

  • High logic density: 43,661 logic elements enable complex logic implementations within a single device, reducing the need for multiple FPGAs.
  • Significant on‑chip memory: Approximately 2.14 Mbits of embedded RAM supports local buffering and data handling without external memory.
  • Extensive I/O count: 218 I/Os offer flexibility to interface with numerous peripherals, sensors, and communication lines directly.
  • Industrial temperature range: Rated from −40 °C to 100 °C to meet the thermal demands of industrial deployments.
  • Compact BGA package: 324‑LFBGA (15×15) package balances board space and pin density for compact system designs.
  • Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing and procurement.

Why Choose XC6SLX45-3CSG324I?

The XC6SLX45-3CSG324I positions itself as a mid-range Spartan‑6 LX FPGA offering a balance of programmable logic capacity, embedded memory, and a high count of I/Os in a compact BGA package. Its industrial temperature rating and RoHS compliance make it a practical selection for engineers who need reliable, reprogrammable logic in demanding environments.

This device is appropriate for designs that require substantial on‑chip resources and flexible external connectivity while maintaining a compact board footprint and predictable core power requirements. Its combination of logic density, on‑chip RAM, and industrial operating range delivers long‑term value for projects that prioritize integration and environmental robustness.

Request a quote or submit an inquiry to get pricing and availability for the XC6SLX45-3CSG324I.

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