XC6SLX45-3CSG484I

The XC6SLX45-3CSG484I is a Spartan®‑6 LX field programmable gate array (FPGA) from AMD, supplied in a 484‑ball CSPBGA (19 × 19) package. It provides a balance of programmable logic capacity, embedded memory, and I/O density targeted at industrial embedded applications where robust temperature and supply ranges are required.

This device integrates 43,661 logic elements, approximately 2.14 Mbits of on-chip RAM, and 320 I/O pins, enabling designers to implement custom logic, memory buffering, and high-density interfacing in a compact surface-mount package.

Key Features

• Core Logic  43,661 logic elements for implementing customized digital logic and state machines.
• Embedded Memory  Approximately 2.14 Mbits of on-chip RAM suitable for data buffering, FIFOs, and small lookup tables.
• I/O Density  320 I/O pins to support multiple parallel interfaces, GPIO expansion, and mixed-signal front-end connections.
• Power  Core voltage supply range of 1.14 V to 1.26 V for defined power budgeting and system integration.
• Package  484‑FBGA (CSPBGA) 19 × 19 package footprint for high-density, surface-mount board designs.
• Temperature and Grade  Industrial grade device rated for operation from −40 °C to 100 °C, suitable for extended-temperature applications.
• Compliance  RoHS compliant construction for regulatory and environmental alignment.

Typical Applications

• Industrial Automation  Implement real-time control logic, I/O aggregation, and protocol bridging in factory and process control equipment.
• Communications Equipment  Support custom packet handling, interface adaptation, and parallel I/O tasks in networking and comms systems.
• Embedded Systems  Provide programmable logic and memory resources for embedded controllers, data acquisition, and custom signal routing.

Unique Advantages

• Significant Logic Capacity:  43,661 logic elements let designers implement complex state machines and custom datapaths without external processors.
• Integrated Memory:  Approximately 2.14 Mbits of on-chip RAM reduces the need for external memory for buffering and small data storage tasks.
• High I/O Count:  320 I/Os enable dense interfacing to sensors, ADC/DAC front-ends, buses, and expansion connectors.
• Industrial Temperature Rating:  Operation from −40 °C to 100 °C supports deployment in harsher environments where extended temperature reliability is required.
• Compact Surface-Mount Package:  The 484‑CSPBGA (19 × 19) package offers a space-efficient footprint for high-density PCBs.
• RoHS Compliant:  Environmentally compliant manufacturing simplifies regulatory conformity for many end products.

Why Choose XC6SLX45-3CSG484I?

The XC6SLX45-3CSG484I combines substantial programmable logic, embedded RAM, and a large I/O complement in a compact CSPBGA package designed for industrial operating conditions. It is well suited to development teams requiring on-chip memory and significant logic resources while maintaining a defined core-voltage range for system power planning.

Choose this FPGA when your design needs programmable flexibility, robust temperature performance, and a high pin count in a surface-mount form factor, with the assurance of RoHS compliance and AMD platform support.

Request a quote or submit an inquiry to receive pricing and availability for the XC6SLX45-3CSG484I and to discuss how it can fit your next industrial FPGA design.