XC6SLX45-3FGG484C

The XC6SLX45-3FGG484C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) from AMD provided in a 484-ball BGA package. This surface-mount commercial-grade device offers a balance of programmable logic capacity, on-chip memory and I/O density for a range of embedded and digital designs.

Key device attributes include approximately 43,661 logic elements, about 2.14 Mbits of embedded RAM, 316 I/O pins, a 484-BBGA package (supplier device package: 484-FBGA (23x23)), and a core supply range of 1.14 V to 1.26 V. The device is rated for 0 °C to 85 °C operating temperature and is RoHS compliant.

Key Features

• Core Architecture  The Spartan-6 LX field programmable gate array architecture from AMD in the XC6SLX45-3FGG484C configuration.
• Logic Capacity  Approximately 43,661 logic elements to implement medium-density FPGA designs.
• Embedded Memory  Approximately 2.14 Mbits of on-chip RAM for buffering, FIFOs and small data storage needs.
• I/O Count  316 I/O pins to support multiple interfaces and peripheral connections.
• Power  Core voltage supply range of 1.14 V to 1.26 V for device operation.
• Package & Mounting  484-BBGA package case with supplier device package listed as 484-FBGA (23x23); surface-mount mounting type.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Unique Advantages

• Substantial logic resources: Approximately 43,661 logic elements allow implementation of complex logic functions without external ASICs.
• On-chip memory for data handling: About 2.14 Mbits of embedded RAM supports buffering and on-device data processing.
• High I/O availability: 316 I/O pins provide flexibility for connecting numerous peripherals and external interfaces.
• Compact BGA footprint: 484-ball BGA (supplier 484-FBGA (23x23)) enables a high-density board layout with surface-mount assembly.
• Commercial temperature rating: 0 °C to 85 °C supports standard commercial operating environments.
• Regulatory compliance: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose XC6SLX45-3FGG484C?

The XC6SLX45-3FGG484C presents a balanced option for designers needing moderate logic capacity, embedded memory and plentiful I/O in a compact BGA package. Its specification set—approximately 43,661 logic elements, roughly 2.14 Mbits of on-chip RAM and 316 I/Os—makes it suitable for projects that require integrated programmable logic with substantial I/O and memory resources while remaining within commercial temperature bounds.

Backed by AMD’s Spartan-6 LX family documentation and datasheet resources, this device is appropriate for teams targeting medium-density FPGA implementations where RoHS compliance and a surface-mount 484-BBGA package are required.

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