XC6SLX45-3FGG676C

The XC6SLX45-3FGG676C is a Spartan®-6 LX field programmable gate array (FPGA) from AMD, delivered in a 676-ball fine-pitch BGA package. This commercial-grade FPGA provides a balance of programmable logic capacity, on-chip memory, and high I/O density for a range of commercial embedded designs.

With 43,661 logic elements, approximately 2.14 Mbits of embedded memory and 358 I/O, the device targets designers needing scalable programmable logic in a compact surface-mount package while operating across a commercial temperature range.

Key Features

• Core Logic — 43,661 logic elements to implement user-defined digital functions and custom logic architectures.
• Embedded Memory — Approximately 2.14 Mbits of on-chip RAM for buffering, FIFOs and local data storage.
• I/O Density — 358 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Package — 676-ball FBGA (27×27 mm) package case (676-BGA) suitable for high-density PCB layouts; surface-mount mounting type.
• Power — Core supply voltage range of 1.14 V to 1.26 V to match system power domains.
• Temperature & Grade — Commercial grade operation from 0 °C to 85 °C for standard commercial applications.
• Environmental Compliance — RoHS compliant construction.

Typical Applications

• Custom digital logic and prototyping — Implement user-defined logic functions and iterate designs using the device's 43,661 logic elements and on-chip memory.
• High-density I/O interfacing — Leverage 358 I/O pins to connect multiple sensors, peripherals or parallel interfaces in compact systems.
• Embedded buffering and data handling — Use approximately 2.14 Mbits of embedded memory for data buffering, packet handling or temporary storage within commercial embedded projects.

Unique Advantages

• Substantial logic capacity: 43,661 logic elements provide headroom for complex combinational and sequential logic implementations without external logic.
• On-chip memory availability: Approximately 2.14 Mbits of RAM reduces reliance on external memory for many buffering and storage tasks.
• High I/O count: 358 I/O pins support multiple parallel interfaces and diverse peripheral connections, simplifying board-level routing.
• Compact FBGA package: 676-FBGA (27×27 mm) enables dense PCB designs while remaining a surface-mount solution.
• Commercial temperature suitability: Rated for 0 °C to 85 °C to meet standard commercial application environments.
• RoHS compliant: Conforms to environmental requirements for lead-free assembly.

Why Choose XC6SLX45-3FGG676C?

The XC6SLX45-3FGG676C combines a Spartan®-6 LX FPGA architecture with a significant logic element count, ample embedded memory, and a high I/O count in a compact 676-FBGA package. It is well suited for commercial embedded designs that require adaptable, on-board programmable logic together with robust connectivity and onboard memory resources.

For design teams and procurement professionals seeking a commercially graded FPGA from AMD with clear, verifiable specifications—logic capacity, memory, I/O, package and operating ranges—this device offers a practical foundation for scalable, maintainable designs backed by an established FPGA family.

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