XC6SLX45-3FGG676I

The XC6SLX45-3FGG676I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) in a 676-ball BGA package designed for programmable logic integration. It provides a combination of logic density, embedded RAM, and a high I/O count in a surface-mount 676-FBGA (27×27) package for industrial-grade applications.

With 43,661 logic elements and approximately 2.14 Mbits of on-chip RAM, this device targets designs that require substantial programmable logic, significant embedded memory, and a large number of external interfaces while operating from a core supply between 1.14 V and 1.26 V over an industrial temperature range.

Key Features

• Logic Capacity 43,661 logic elements provide substantial programmable logic resources for complex combinational and sequential functions.
• Embedded Memory Approximately 2.14 Mbits of total on-chip RAM to support buffering, lookup tables, and data storage requirements within the FPGA fabric.
• High I/O Count 358 user I/O pins support extensive external connectivity and parallel interfacing to peripherals and external devices.
• Package and Mounting 676-FBGA (27×27) package with surface-mount mounting enables a compact board footprint while delivering high pin density.
• Voltage Supply Core supply range of 1.14 V to 1.26 V for compatibility with targeted power rails and system designs.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C to meet thermostability needs in industrial environments.
• Compliance RoHS compliant to support environmentally conscious manufacturing and procurement requirements.

Unique Advantages

• High programmable density: 43,661 logic elements enable integration of complex digital functions into a single FPGA, reducing the need for multiple discrete devices.
• On-chip memory resources: Approximately 2.14 Mbits of embedded RAM help minimize external memory dependence for buffering and local data storage.
• Extensive I/O capability: 358 I/O pins allow broad peripheral connectivity and flexible interface options without external I/O expanders.
• Industrial reliability: Specified operation from −40 °C to 100 °C provides suitability for temperature-demanding environments.
• Compact, high-density package: 676-FBGA (27×27) surface-mount package offers a balance of pin count and board area for space-constrained designs.
• Regulatory readiness: RoHS compliance supports regulatory and sustainability goals in product development and manufacturing.

Why Choose XC6SLX45-3FGG676I?

The XC6SLX45-3FGG676I delivers a balanced combination of logic capacity, embedded memory, and extensive I/O in a compact 676-FBGA package, making it well suited for industrial and embedded designs that require programmable logic and robust operating temperature range. Its supply voltage range and RoHS compliance make it practical for integration into modern power architectures and environmentally conscious product lines.

This device is a solid choice for engineers and procurement teams seeking a field-programmable solution with clear, verifiable specifications for logic resources, memory, I/O count, package type, and operating conditions—helping to simplify design decisions and support long-term deployment in industrial environments.

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