XC6SLX45-L1FGG484C

IC FPGA 316 I/O 484FBGA
Part Description

Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 316 2138112 43661 484-BBGA

Quantity 451 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O316Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3411Number of Logic Elements/Cells43661
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2138112

Overview of XC6SLX45-L1FGG484C – Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 316 2138112 43661 484-BBGA

The XC6SLX45-L1FGG484C is a Spartan®-6 LX field programmable gate array from AMD. It delivers a balanced combination of programmable logic, embedded memory and flexible I/O capability in a compact 484-ball BGA package for commercial-grade designs.

With 43,661 logic elements and approximately 2.14 Mbits of on-chip RAM, this surface-mount FPGA targets designs that require medium-scale logic integration, significant on-chip memory and up to 316 I/O pins while operating within a 1.14 V to 1.26 V power window and a 0 °C to 85 °C commercial temperature range.

Key Features

  • Logic Capacity  43,661 logic elements provide substantial programmable fabric for mid-density designs and complex control logic.
  • Embedded Memory  Approximately 2.14 Mbits of on-chip RAM support buffering, LUT-based memory and small data storage without external memory.
  • I/O Density  Up to 316 user I/O pins enable broad interfacing options for sensors, peripherals and parallel/serial buses.
  • Power  Operates from a core supply range of 1.14 V to 1.26 V, suitable for designs with defined low-voltage core requirements.
  • Package and Mounting  484-ball BGA (supplier device package: 484-FBGA, 23×23) in a surface-mount format for compact, high-density PCB layouts.
  • Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Compliance  RoHS compliant for regulatory and environmental considerations.

Unique Advantages

  • High logic integration: 43,661 logic elements reduce the need for multiple discrete devices by consolidating mid-scale logic in a single FPGA.
  • On-chip memory capacity: Approximately 2.14 Mbits of embedded RAM minimizes external memory dependence for buffering and local data storage.
  • Broad I/O count: 316 available I/O pins provide flexibility for dense connectivity and mixed-signal interfacing on a single device.
  • Compact BGA footprint: 484-ball BGA (23×23) enables space-efficient PCB designs while maintaining high pin-count connectivity.
  • Commercial temperature suitability: Rated 0 °C to 85 °C for standard commercial applications and environments.
  • Regulatory readiness: RoHS compliance supports environmentally conscious product builds.

Why Choose XC6SLX45-L1FGG484C?

The XC6SLX45-L1FGG484C positions itself as a mid-density Spartan®-6 LX FPGA that combines significant logic resources, on-chip RAM and a high I/O count within a compact BGA package. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of commercial electronic designs requiring integrated programmable logic.

Designed for engineers seeking a balance of capacity and footprint, this FPGA is a practical choice for consolidating functions, reducing board-level component count and accelerating time-to-market while relying on AMD’s Spartan-6 family heritage.

Request a quote or submit an inquiry to obtain pricing, availability and technical support for the XC6SLX45-L1FGG484C.

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