XC6SLX45-L1FGG484C
| Part Description |
Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 316 2138112 43661 484-BBGA |
|---|---|
| Quantity | 451 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 316 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3411 | Number of Logic Elements/Cells | 43661 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2138112 |
Overview of XC6SLX45-L1FGG484C – Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 316 2138112 43661 484-BBGA
The XC6SLX45-L1FGG484C is a Spartan®-6 LX field programmable gate array from AMD. It delivers a balanced combination of programmable logic, embedded memory and flexible I/O capability in a compact 484-ball BGA package for commercial-grade designs.
With 43,661 logic elements and approximately 2.14 Mbits of on-chip RAM, this surface-mount FPGA targets designs that require medium-scale logic integration, significant on-chip memory and up to 316 I/O pins while operating within a 1.14 V to 1.26 V power window and a 0 °C to 85 °C commercial temperature range.
Key Features
- Logic Capacity 43,661 logic elements provide substantial programmable fabric for mid-density designs and complex control logic.
- Embedded Memory Approximately 2.14 Mbits of on-chip RAM support buffering, LUT-based memory and small data storage without external memory.
- I/O Density Up to 316 user I/O pins enable broad interfacing options for sensors, peripherals and parallel/serial buses.
- Power Operates from a core supply range of 1.14 V to 1.26 V, suitable for designs with defined low-voltage core requirements.
- Package and Mounting 484-ball BGA (supplier device package: 484-FBGA, 23×23) in a surface-mount format for compact, high-density PCB layouts.
- Operating Range & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Compliance RoHS compliant for regulatory and environmental considerations.
Unique Advantages
- High logic integration: 43,661 logic elements reduce the need for multiple discrete devices by consolidating mid-scale logic in a single FPGA.
- On-chip memory capacity: Approximately 2.14 Mbits of embedded RAM minimizes external memory dependence for buffering and local data storage.
- Broad I/O count: 316 available I/O pins provide flexibility for dense connectivity and mixed-signal interfacing on a single device.
- Compact BGA footprint: 484-ball BGA (23×23) enables space-efficient PCB designs while maintaining high pin-count connectivity.
- Commercial temperature suitability: Rated 0 °C to 85 °C for standard commercial applications and environments.
- Regulatory readiness: RoHS compliance supports environmentally conscious product builds.
Why Choose XC6SLX45-L1FGG484C?
The XC6SLX45-L1FGG484C positions itself as a mid-density Spartan®-6 LX FPGA that combines significant logic resources, on-chip RAM and a high I/O count within a compact BGA package. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of commercial electronic designs requiring integrated programmable logic.
Designed for engineers seeking a balance of capacity and footprint, this FPGA is a practical choice for consolidating functions, reducing board-level component count and accelerating time-to-market while relying on AMD’s Spartan-6 family heritage.
Request a quote or submit an inquiry to obtain pricing, availability and technical support for the XC6SLX45-L1FGG484C.

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