XC6SLX45-N3CSG324I

The XC6SLX45-N3CSG324I is a Spartan®-6 LX field programmable gate array (FPGA) from AMD provided in a 324-pin LFBGA/CSPBGA package. It offers 43,661 logic elements, approximately 2.14 Mbits of embedded memory, and 218 user I/O pins in a surface-mount 324-CSPBGA (15×15) package.

Rated for industrial operation with a supply voltage range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C, this device is targeted at programmable-logic designs that require on-chip memory, substantial logic capacity, and a robust thermal range.

Key Features

• Core Logic – 43,661 logic elements to implement custom digital logic, state machines, and control functions.
• Embedded Memory – Approximately 2.14 Mbits of on-chip RAM for buffering, FIFOs, and local storage without external memory.
• I/O Count – 218 user I/O pins to support multiple parallel interfaces and high pin-count connectivity.
• Power – Supported device supply range from 1.14 V to 1.26 V for the core supply domain.
• Package & Mounting – 324-LFBGA (324-CSPBGA, 15×15) surface-mount package to enable compact, high-density board designs.
• Temperature & Grade – Industrial grade device with an operating temperature range of −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance – RoHS-compliant construction for environmental compliance in assembly.

Typical Applications

• Programmable Logic and Glue-Logic – Implement custom control, bus bridging, and interface adaptation within embedded systems using the device’s logic capacity and abundant I/O.
• On-Board Data Buffering – Use the approximately 2.14 Mbits of embedded RAM for buffering, packet queues, and temporary storage close to processing logic.
• Industrial Control – Deploy in industrial-temperature environments that require dependable operation from −40 °C to 100 °C and industrial-grade components.

Unique Advantages

• Substantial Logic Capacity: 43,661 logic elements enable implementation of complex state machines, custom accelerators, and multiple concurrent functions on a single device.
• On-Chip Memory: Approximately 2.14 Mbits of embedded RAM reduces the need for external memory for many buffering and local-storage tasks, simplifying board design.
• High I/O Density: 218 user I/O pins provide flexibility to connect multiple interfaces, sensors, and peripherals without additional multiplexing hardware.
• Industrial Temperature Rating: −40 °C to 100 °C operating range supports designs intended for harsher thermal environments.
• Compact Package: 324-CSPBGA (15×15) surface-mount package supports space-constrained PCBs while offering a high pin count for connectivity.
• RoHS Compliance: Environmentally compliant manufacturing supports regulatory and assembly requirements.

Why Choose XC6SLX45-N3CSG324I?

The XC6SLX45-N3CSG324I combines a large logic capacity, significant on-chip RAM, and a high number of I/O pins within a compact 324-LFBGA package, making it suitable for designs that require integration of multiple digital functions into a single programmable device. Its industrial-grade rating and wide operating temperature range make it a practical choice for applications that must operate reliably across extended temperature conditions.

As an AMD Spartan®-6 LX device, it delivers a balance of integration and board-level density for projects where embedded memory, I/O flexibility, and industrial-temperature operation are key selection criteria.

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