XC6SLX45-N3CSG484C
| Part Description |
Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 320 2138112 43661 484-FBGA, CSPBGA |
|---|---|
| Quantity | 1,625 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-CSPBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-FBGA, CSPBGA | Number of I/O | 320 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3411 | Number of Logic Elements/Cells | 43661 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2138112 |
Overview of XC6SLX45-N3CSG484C – Spartan®-6 LX FPGA, 484‑CSPBGA
The XC6SLX45-N3CSG484C is an AMD Spartan‑6 LX Field Programmable Gate Array (FPGA) in a 484‑CSPBGA (19×19) package. It provides mid‑range programmable logic resources, on‑chip memory and high I/O density for a wide range of embedded and communications applications.
Designed for surface‑mount assembly and commercial temperature operation, this device balances logic capacity, memory and I/O to support compact, low‑voltage designs.
Key Features
- Logic Capacity — 43,661 logic elements to implement custom digital functions and state machines.
- Embedded Memory — Approximately 2.14 Mbits of on‑chip RAM for buffering, FIFOs and small data stores.
- I/O Resources — 320 general purpose I/O pins to interface with peripherals, sensors and high‑density connectors.
- Package — 484‑FBGA / 484‑CSPBGA (19×19) package suitable for space‑constrained board designs and high pin count layouts.
- Power — Core supply range of 1.14 V to 1.26 V to match low‑voltage power domains.
- Mounting & Grade — Surface mount device with commercial grade qualification and an operating range of 0 °C to 85 °C.
- Environmental Compliance — RoHS compliant for regulatory alignment in commercial product assemblies.
Typical Applications
- Embedded Systems — Implements custom control logic, protocol handling and peripheral aggregation in compact embedded platforms.
- Communications Equipment — Provides programmable logic and buffering for protocol bridging, packet handling and interface adaptation using high I/O counts.
- Consumer Electronics — Enables feature integration and custom I/O handling in consumer devices where board space and power are constrained.
- Prototyping & Development — Acts as a mid‑density target for hardware validation and proof‑of‑concept implementations that require significant logic and embedded RAM.
Unique Advantages
- High Logic Density: 43,661 logic elements provide substantial capacity for implementing complex combinational and sequential logic without external glue logic.
- Significant On‑Chip RAM: Approximately 2.14 Mbits of embedded memory reduces reliance on external memory for buffering and temporary storage.
- Large I/O Count: 320 I/Os enable direct connectivity to multiple peripherals, sensors and high‑speed interfaces, simplifying board design.
- Compact, High‑Pin Package: The 484‑CSPBGA (19×19) package delivers a high pin count in a compact footprint for dense system integration.
- Low‑Voltage Core Compatibility: A core supply window of 1.14 V–1.26 V supports integration with low‑voltage power rails.
- Regulatory Preparedness: RoHS compliance supports environmental requirements for commercial product assemblies.
Why Choose XC6SLX45-N3CSG484C?
The XC6SLX45-N3CSG484C positions itself as a mid‑range Spartan‑6 LX FPGA that blends substantial logic resources, on‑chip memory and a high I/O count in a compact 484‑CSPBGA package. Its low‑voltage core and surface‑mount form factor make it suitable for board designs where power efficiency and space are important considerations.
This device is well suited for design teams building embedded systems, communications modules and consumer products that require a balance of integration, configurable logic and on‑chip storage while operating within commercial temperature limits.
Request a quote or submit an inquiry to receive pricing and availability for the XC6SLX45-N3CSG484C and to discuss how it fits your next design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








