XC6SLX45-N3FG676I

The XC6SLX45-N3FG676I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD. It delivers a balance of logic density, embedded memory and I/O capability in a compact 676-ball FBGA package.

With 43,661 logic elements, approximately 2.14 Mbits of on-chip RAM and 358 user I/Os, this device is specified for industrial-grade applications and extended temperature operation between −40 °C and 100 °C. It operates from a core supply range of 1.14 V to 1.26 V and is supplied in a surface-mount 676-FBGA (27×27) package.

Key Features

• Core Logic  Approximately 43,661 logic elements provide configurable logic resources for implementing custom digital functions and control logic.
• Embedded Memory  Approximately 2.14 Mbits of on-chip RAM for buffering, FIFOs, and small data-storage blocks within designs.
• I/O Capacity  Up to 358 user I/Os to support wide peripheral and bus interfacing needs in a single device.
• Power  Core supply voltage range of 1.14 V to 1.26 V to match system power-rail requirements.
• Package & Mounting  676-ball FBGA (27×27) package in a surface-mount configuration for compact board-level integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet extended-environment requirements.
• RoHS Compliance  Manufactured in compliance with RoHS requirements.

Typical Applications

• Industrial Control & Automation  Use the device where extended temperature operation and industrial-grade qualification are required, taking advantage of the available logic elements and I/O count for control, sequence logic and interfacing.
• Protocol Bridging & Interface Aggregation  High I/O count supports designs that aggregate or translate multiple serial, parallel or custom peripheral interfaces.
• Embedded Signal Processing  On-chip RAM and configurable logic allow implementation of buffering, packet handling and custom data-path functions.

Unique Advantages

• Balanced Logic and Memory  Approximately 43,661 logic elements paired with ~2.14 Mbits of embedded RAM provide the resources needed for moderate-complexity designs without external memory for many use cases.
• High I/O Integration  358 user I/Os help reduce the need for external interface components, simplifying board-level design and lowering BOM count.
• Industrial Readiness  Rated for −40 °C to 100 °C operation and supplied in a robust 676-FBGA package suitable for surface-mount assembly in industrial applications.
• Compact Package  The 676-ball FBGA (27×27) offers a space-efficient footprint while retaining ample I/O and routing resources.
• Low-Voltage Core  Operation within a 1.14 V to 1.26 V core supply window supports modern low-voltage system designs.

Why Choose XC6SLX45-N3FG676I?

The XC6SLX45-N3FG676I combines a substantial pool of configurable logic, embedded RAM and a large I/O count in a compact 676-FBGA package rated for industrial temperatures. This combination makes it well suited for designers who need a reprogrammable, mid-density FPGA platform for industrial, interface- and control-focused designs.

Its industrial-grade temperature range, RoHS compliance and surface-mount FBGA footprint deliver a practical balance of integration, durability and size for production deployments where extended environmental performance and board-level density matter.

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