XC6SLX45T-2CSG324C

The XC6SLX45T-2CSG324C is a Spartan®-6 LXT field programmable gate array (FPGA) from AMD supplied in a 324-LFBGA (15×15) CSPBGA package. It delivers a combination of configurable logic, embedded RAM and I/O density intended for commercial embedded designs that require programmable logic in a compact, surface-mount package.

Key Features

• Configurable Logic 3,411 configurable logic blocks (CLBs) providing 43,661 logic elements to implement custom digital functions.
• On-Chip Memory Approximately 2.14 Mbits of embedded RAM for buffering, FIFOs and memory-mapped logic.
• I/O Resources 190 I/O pins to support a wide range of external interfaces and board-level connectivity.
• Power Voltage supply range of 1.14 V to 1.26 V as specified for the device.
• Package and Mounting 324-LFBGA, CSPBGA (15×15) package designed for surface-mount PCB assembly and compact system integration.
• Operational Grade and Temperature Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant.

Typical Applications

• Commercial Embedded Systems — Use the FPGA to implement custom logic, protocol bridges or glue logic in commercial electronic products requiring programmable hardware.
• Consumer and Professional Electronics — Leverage the on-chip RAM and 190 I/Os for display control, peripheral interfacing or signal conditioning in compact assemblies.
• Communications and Networking — Deploy the device for packet buffering, interface adaptation or control plane functions where moderate logic and memory resources are needed.
• Prototype and Development Boards — Provide a flexible hardware platform for evaluating designs that need substantial logic elements and embedded memory within a small BGA footprint.

Unique Advantages

• Balanced Logic Capacity: 43,661 logic elements and 3,411 CLBs enable implementation of substantial custom logic without excessive device size.
• Significant On-Chip Memory: Approximately 2.14 Mbits of embedded RAM reduces external memory dependency for many buffering and state-machine requirements.
• High I/O Count: 190 I/Os allow flexible connectivity to peripherals, sensors and interfaces on modern boards.
• Compact BGA Package: The 324-LFBGA (15×15) CSPBGA package supports dense PCB integration and surface-mount assembly.
• Commercial Temperature Range: Rated 0 °C to 85 °C to match commercial-grade product requirements.
• Regulatory Compliance: RoHS compliance supports environmentally conscious designs and supply-chain requirements.

Why Choose XC6SLX45T-2CSG324C?

The XC6SLX45T-2CSG324C provides a practical balance of logic resources, embedded memory and I/O in a compact 324-LFBGA package from the Spartan®-6 LXT family by AMD. Its specification set is suited to designers targeting commercial embedded applications that need programmable hardware density without moving to larger, higher-cost devices.

For development teams and procurement seeking a RoHS-compliant, surface-mount FPGA with defined voltage and temperature ranges, this device offers predictable integration characteristics and clear resource metrics for system-level planning.

Request a quote or submit an inquiry to obtain pricing and availability for the XC6SLX45T-2CSG324C.