XC6SLX45-N3FGG484C
| Part Description |
Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 316 2138112 43661 484-BBGA |
|---|---|
| Quantity | 4 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 316 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3411 | Number of Logic Elements/Cells | 43661 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2138112 |
Overview of XC6SLX45-N3FGG484C – Spartan®-6 LX FPGA, 484‑BBGA
The XC6SLX45-N3FGG484C is a Spartan®-6 LX field programmable gate array (FPGA) in a 484‑BBGA package intended for commercial electronic designs. It provides a balanced combination of logic capacity, on-chip embedded memory and high I/O count to support a range of FPGA-based integration and system functions.
Designed for surface-mount assembly and RoHS-compliant production, this device is specified for operation from 0°C to 85°C with a core supply range of 1.14 V to 1.26 V.
Key Features
- Logic Capacity 43,661 logic elements for implementing medium-complexity digital designs and custom logic functions.
- Embedded Memory Approximately 2.138 Mbits of on-chip RAM to support buffering, state storage and small data tables.
- I/O Resources 316 user I/O pins to interface with peripherals, sensors and external buses.
- Power Core voltage supply specified from 1.14 V to 1.26 V to match system power requirements.
- Package & Mounting 484-BBGA package (supplier device package: 484-FBGA, 23×23) designed for surface-mount assembly in compact board layouts.
- Operating Range & Grade Commercial grade device rated for 0°C to 85°C ambient operation.
- Environmental Compliance RoHS-compliant for lead-free production and regulatory alignment.
Unique Advantages
- High logic density: 43,661 logic elements enable integration of sizable custom logic without external ASICs or glue logic.
- Generous embedded RAM: Approximately 2.138 Mbits of on-chip memory reduces the need for external SRAM in many buffering and storage tasks.
- Extensive I/O count: 316 user I/Os simplify board-level connectivity and support multiple parallel interfaces.
- Compact surface-mount package: 484-FBGA (23×23) packaging allows dense PCB designs and reliable solder assembly.
- Commercial temperature suitability: Specified 0°C to 85°C operation aligns with a wide range of commercial electronics applications.
- RoHS compliance: Supports lead-free manufacturing and regulatory requirements for many markets.
Why Choose XC6SLX45-N3FGG484C?
The XC6SLX45-N3FGG484C positions itself as a practical FPGA choice for commercial designs that require substantial logic resources, embedded memory, and a high number of I/Os in a compact surface-mount package. Its electrical and thermal specifications make it suitable for standard commercial environments where integration and board-level density are priorities.
Engineers and procurement teams looking for a RoHS-compliant FPGA with clear, verifiable specifications for logic capacity, on-chip memory and I/O count will find this device appropriate for medium-complexity programmable logic implementations and system integration tasks.
Request a quote or submit a purchase inquiry to get pricing and availability for the XC6SLX45-N3FGG484C.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








