XC6SLX45-N3FGG484C

IC FPGA 316 I/O 484FBGA
Part Description

Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 316 2138112 43661 484-BBGA

Quantity 4 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O316Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3411Number of Logic Elements/Cells43661
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2138112

Overview of XC6SLX45-N3FGG484C – Spartan®-6 LX FPGA, 484‑BBGA

The XC6SLX45-N3FGG484C is a Spartan®-6 LX field programmable gate array (FPGA) in a 484‑BBGA package intended for commercial electronic designs. It provides a balanced combination of logic capacity, on-chip embedded memory and high I/O count to support a range of FPGA-based integration and system functions.

Designed for surface-mount assembly and RoHS-compliant production, this device is specified for operation from 0°C to 85°C with a core supply range of 1.14 V to 1.26 V.

Key Features

  • Logic Capacity  43,661 logic elements for implementing medium-complexity digital designs and custom logic functions.
  • Embedded Memory  Approximately 2.138 Mbits of on-chip RAM to support buffering, state storage and small data tables.
  • I/O Resources  316 user I/O pins to interface with peripherals, sensors and external buses.
  • Power  Core voltage supply specified from 1.14 V to 1.26 V to match system power requirements.
  • Package & Mounting  484-BBGA package (supplier device package: 484-FBGA, 23×23) designed for surface-mount assembly in compact board layouts.
  • Operating Range & Grade  Commercial grade device rated for 0°C to 85°C ambient operation.
  • Environmental Compliance  RoHS-compliant for lead-free production and regulatory alignment.

Unique Advantages

  • High logic density: 43,661 logic elements enable integration of sizable custom logic without external ASICs or glue logic.
  • Generous embedded RAM: Approximately 2.138 Mbits of on-chip memory reduces the need for external SRAM in many buffering and storage tasks.
  • Extensive I/O count: 316 user I/Os simplify board-level connectivity and support multiple parallel interfaces.
  • Compact surface-mount package: 484-FBGA (23×23) packaging allows dense PCB designs and reliable solder assembly.
  • Commercial temperature suitability: Specified 0°C to 85°C operation aligns with a wide range of commercial electronics applications.
  • RoHS compliance: Supports lead-free manufacturing and regulatory requirements for many markets.

Why Choose XC6SLX45-N3FGG484C?

The XC6SLX45-N3FGG484C positions itself as a practical FPGA choice for commercial designs that require substantial logic resources, embedded memory, and a high number of I/Os in a compact surface-mount package. Its electrical and thermal specifications make it suitable for standard commercial environments where integration and board-level density are priorities.

Engineers and procurement teams looking for a RoHS-compliant FPGA with clear, verifiable specifications for logic capacity, on-chip memory and I/O count will find this device appropriate for medium-complexity programmable logic implementations and system integration tasks.

Request a quote or submit a purchase inquiry to get pricing and availability for the XC6SLX45-N3FGG484C.

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