XC6SLX45-N3FG676C

The XC6SLX45-N3FG676C is a Spartan®-6 LX field programmable gate array (FPGA) from AMD, delivered in a 676-BGA package. It provides a combination of programmable logic, embedded memory, and high I/O count for commercial electronic designs.

With 43,661 logic elements, approximately 2.14 Mbits of embedded memory and 358 user I/Os, this device targets applications that require significant on-chip logic and interfacing capacity in a compact surface-mount package.

Key Features

• Core Logic Resources – 43,661 logic elements to implement user-configurable digital functions and control logic.
• Embedded Memory – Approximately 2.14 Mbits of on-chip RAM for data buffering, state storage and intermediate processing.
• I/O Density – 358 user I/O pins to support multiple interfaces, peripherals and high-density interconnect requirements.
• Package and Mounting – 676-BGA (supplier package: 676-FBGA, 27×27) in a surface-mount form factor for compact board layouts.
• Supply Voltage – Core voltage range of 1.14 V to 1.26 V to match system power designs.
• Commercial Temperature Grade – Rated for operation from 0 °C to 85 °C, suitable for standard commercial environments.
• Environmental Compliance – RoHS compliant for adherence to common environmental requirements.

Typical Applications

• Embedded system logic – Implement custom control and glue logic using the device’s 43,661 logic elements and embedded RAM for compact commercial designs.
• High-density I/O interfacing – Use the 358 I/Os to bridge multiple peripherals, sensors and external interfaces on a single FPGA.
• Prototyping and development – Deploy the Spartan-6 LX device for evaluation and iterative design work where programmable logic and significant on-chip memory are needed.

Unique Advantages

• Balanced logic and memory: 43,661 logic elements paired with approximately 2.14 Mbits of embedded RAM enables complex logic implementations with local data storage.
• High I/O capacity: 358 user I/Os reduce the need for external multiplexing and simplify board-level interfacing.
• Compact BGA package: 676-BGA (676-FBGA, 27×27) delivers a space-efficient footprint for dense board designs.
• Commercial temperature rating: Rated 0 °C to 85 °C to meet requirements of standard commercial applications.
• Low-level supply specification: Narrow core voltage range (1.14 V–1.26 V) supports consistent power design and voltage planning.
• RoHS compliance: Meets common environmental standards for lead-free manufacturing and assembly.

Why Choose XC6SLX45-N3FG676C?

The XC6SLX45-N3FG676C offers a dependable blend of logic density, embedded memory and extensive I/O in a compact 676-BGA surface-mount package. Its specification set—43,661 logic elements, approximately 2.14 Mbits of on-chip RAM and 358 I/Os—suits designers building commercial electronic systems that require significant programmable logic and interfacing capability.

Choose this Spartan®-6 LX device when you need a commercially graded FPGA with a defined supply range and RoHS compliance, enabling streamlined integration into compact, production-oriented board designs.

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