XC6SLX45-N3FG484I

The XC6SLX45-N3FG484I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD designed for industrial-grade programmable logic applications. It combines a substantial logic element count with on-chip RAM and a high pin count, offering a compact, surface-mount FPGA solution for industrial environments.

With an operating temperature range from -40 °C to 100 °C and RoHS compliance, this device is intended for designs that require reliable programmable logic in demanding temperature conditions and compact BGA packaging.

Key Features

• Logic Capacity — 43,661 logic elements (logic cells) to implement custom digital logic and state machines.
• Embedded Memory — Approximately 2.14 Mbits of on-chip RAM (2,138,112 total RAM bits) to support buffering, FIFOs, and localized data storage.
• I/O Density — 316 user I/O pins to enable multiple interfaces and signal routing directly from the FPGA.
• Power Supply — Core supply range of 1.14 V to 1.26 V for the FPGA core voltage domain.
• Package & Mounting — 484‑BBGA package with surface-mount mounting; supplier device package listed as 484‑FBGA (23×23) for board-level planning.
• Industrial Temperature Range — Rated for -40 °C to 100 °C operation for use in temperature-challenged environments.
• Regulatory — RoHS compliant, supporting environmentally conscious assembly and regulatory requirements.

Typical Applications

• Industrial Control — Programmable logic functions in industrial equipment where the device's -40 °C to 100 °C range and industrial grade are required.
• I/O-Intensive Interfaces — Systems requiring high pin counts can leverage the 316 I/O for multiple parallel interfaces and signal routing.
• On-Chip Data Processing — Designs that benefit from embedded memory and logic elements for localized buffering, custom datapaths, and protocol handling.

Unique Advantages

• Substantial Logic Resources: 43,661 logic elements provide capacity for mid-density FPGA designs without external logic.
• Integrated On-Chip Memory: Approximately 2.14 Mbits of embedded RAM reduces dependence on external memory for many buffering and temporary storage needs.
• High I/O Count: 316 I/O pins enable dense interface integration and flexible signal connectivity directly from the FPGA.
• Compact BGA Packaging: 484‑BBGA (supplier: 484‑FBGA, 23×23) reduces PCB area compared with larger packages while supporting surface-mount assembly.
• Industrial Temperature Qualification: Rated for -40 °C to 100 °C to meet thermal requirements for many industrial deployments.
• RoHS Compliant: Meets environmental compliance needs for modern manufacturing processes.

Why Choose XC6SLX45-N3FG484I?

The XC6SLX45-N3FG484I balances significant programmable logic capacity, embedded memory, and a high I/O count in a compact BGA package tailored for industrial environments. Its voltage and temperature specifications make it suitable for engineers seeking a mid-density FPGA solution that can withstand extended temperature ranges while keeping board space and external component count under control.

This device is appropriate for development teams and product designers targeting industrial and I/O-dense applications that require on-chip memory and substantial logic resources in a surface-mount FPGA package.

Request a quote or submit a purchasing inquiry for the XC6SLX45-N3FG484I to discuss availability and pricing for your design needs.