XC6SLX45-N3FGG676C

The XC6SLX45-N3FGG676C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) in a 676-ball fine-pitch BGA package. It provides a high-density, commercial-grade programmable logic fabric with substantial on-chip memory and a large I/O count for compact, board-level integration.

Designed for commercial applications that require flexible hardware configurability, this device combines tens of thousands of logic elements, approximately 2.14 Mbits of embedded memory, and 358 I/O to support complex logic, control, and interfacing requirements while operating from a 1.14 V to 1.26 V core supply.

Key Features

• Logic Capacity — 3,411 logic blocks (43,661 logic elements) for implementing complex combinational and sequential logic.
• Embedded Memory — Approximately 2.14 Mbits of on-chip RAM to support buffering, lookup tables, and state storage without external memory.
• I/O Density — 358 user I/O pins to accommodate diverse peripheral interfacing and system I/O requirements.
• Package & Mounting — 676-FBGA package (27×27 mm) with surface-mount mounting suitable for compact PCB designs.
• Power — Core voltage supply range of 1.14 V to 1.26 V for compatibility with platform power rails.
• Operating Range & Grade — Commercial-grade device rated for 0 °C to 85 °C operation.
• Compliance — RoHS-compliant manufacturing.

Typical Applications

• Embedded Logic and Control — Implement custom control engines and glue logic using the available 43,661 logic elements and on-chip RAM.
• Interface Consolidation — Aggregate and translate multiple I/O standards and peripherals using the device’s 358 I/O pins.
• Prototyping and Development — Rapidly iterate hardware designs in a compact 676-FBGA package for bench and board-level testing.
• Data Buffering and State Machines — Use the approximately 2.14 Mbits of embedded memory for buffering, FIFOs, and state storage in control and sequencing applications.

Unique Advantages

• High logic density: 43,661 logic elements enable complex logic implementations without immediate need for larger packages.
• Substantial onboard memory: Approximately 2.14 Mbits of embedded RAM reduces dependence on external memory components and simplifies BOM.
• Large I/O count: 358 I/O pins provide flexibility for multi-peripheral systems and high-connectivity designs.
• Compact FBGA footprint: 676-FBGA (27×27) balances pin count and board area for space-constrained applications.
• Commercial-grade operating range: Rated 0 °C to 85 °C, suitable for a wide range of non-industrial environments.
• RoHS-compliant: Manufactured to RoHS standards for regulatory and environmental compliance.

Why Choose XC6SLX45-N3FGG676C?

The XC6SLX45-N3FGG676C provides a practical combination of logic capacity, embedded memory, and I/O in a compact 676-FBGA package, making it suitable for commercial applications that need programmable hardware flexibility without excessive board space. Its defined core voltage range and RoHS compliance simplify system integration and procurement for commercial product lines.

This FPGA fits designs that require mid-to-high logic density, significant on-chip RAM, and broad I/O connectivity, offering a balance of integration and scalability for developers and procurement teams focused on commercial electronic products.

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