XC6SLX45-N3FGG676I

The XC6SLX45-N3FGG676I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD provided in a 676-ball BGA package. It combines substantial on-chip logic capacity, embedded RAM, and a high I/O count for industrial-grade, board-mounted applications.

Key device attributes include 43,661 logic elements, approximately 2.14 Mbits of embedded memory, 358 I/O pins, a 676-FBGA (27×27) package, an operating voltage range of 1.14 V to 1.26 V, and an industrial operating temperature range of −40 °C to 100 °C.

Key Features

• Logic Resources 43,661 logic elements provide the programmable fabric for implementing custom digital functions and state machines.
• Embedded Memory Approximately 2.14 Mbits of on-chip RAM for buffering, FIFOs, and small data stores without external memory.
• I/O Capacity 358 available I/O pins to interface with peripherals, sensors, and external devices.
• Package & Mounting 676-ball FBGA (27×27) in a surface-mount package suitable for compact, high-density PCB layouts.
• Power Core supply range of 1.14 V to 1.26 V to match system power rails and enable predictable power budgeting.
• Temperature & Grade Industrial-grade qualification and an operating range of −40 °C to 100 °C for deployment in thermally demanding environments.
• Regulatory RoHS-compliant construction to meet environmental lead-free requirements.

Unique Advantages

• Substantial programmable capacity: 43,661 logic elements let designers implement sizable custom logic blocks and integrate multiple functions on a single device, reducing external component count.
• On-chip memory for tighter integration: Approximately 2.14 Mbits of embedded RAM enables local buffering and data handling without immediate reliance on external memory devices.
• High I/O count: 358 I/O pins support broad connectivity to peripherals and sensors, simplifying board-level signal routing and partitioning.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C supports designs that must operate reliably across wide temperature ranges.
• Compact, high-density package: 676-FBGA (27×27) surface-mount packaging delivers a small-footprint solution for space-constrained PCBs while supporting a large number of balls for I/O and power distribution.
• Controlled core voltage range: A defined supply window of 1.14 V to 1.26 V aids predictable power design and thermal planning.

Why Choose XC6SLX45-N3FGG676I?

The XC6SLX45-N3FGG676I positions itself as an industrial-grade Spartan®-6 LX FPGA option when a balance of logic capacity, embedded memory, and I/O density is required in a compact BGA form factor. Its specification set supports integrated digital designs where on-chip resources and wide operating temperatures matter.

This device is suited to engineers and teams looking to consolidate functionality onto a field-programmable device while maintaining control over power, I/O, and thermal margins. The combination of logic elements, embedded RAM, and RoHS compliance delivers a practical platform for long-term production designs that require reprogrammability and board-level integration.

If you would like pricing, availability, or to request a quote for the XC6SLX45-N3FGG676I, please submit a purchase inquiry or request a formal quote through your preferred procurement channel.