XC6SLX45-L1FGG484I

The XC6SLX45-L1FGG484I is a Spartan®-6 LX field programmable gate array designed for industrial-grade embedded logic applications. It provides a dense array of configurable logic with 43,661 logic elements, approximately 2.14 Mbits of embedded memory, and up to 316 user I/Os, enabling a balance of integration and I/O capacity for system-level designs.

Packaged in a compact 484-ball BGA and specified for industrial temperature operation, this device is suited for designs that require substantial on-chip logic and memory within a surface-mount footprint.

Key Features

• Core Logic — 43,661 logic elements provide a high-capacity fabric for implementing custom digital functions and parallel processing pipelines.
• Embedded Memory — Approximately 2.14 Mbits of on-chip RAM for buffering, FIFOs, and local data storage to support high-throughput designs.
• I/O Capability — Up to 316 user I/Os to accommodate broad peripheral interfacing and board-level connectivity requirements.
• Power Supply — Core voltage specified from 1.14 V to 1.26 V for defined power planning and supply sequencing.
• Package & Mounting — 484-BBGA package (supplier device package: 484-FBGA, 23 × 23) in a surface-mount form factor for compact PCB integration.
• Temperature & Grade — Industrial-grade device with operating range from −40 °C to 100 °C for deployment in temperature-demanding environments.
• Environmental Compliance — RoHS compliant for regulatory and manufacturing consistency.

Typical Applications

• Industrial Automation — Use the industrial-grade operating range and extensive I/O to implement control logic, sensor aggregation, and deterministic processing in factory and process environments.
• Custom Digital Processing — Implement bespoke data paths, protocol bridges, and parallel accelerators leveraging the device's large logic capacity and embedded RAM.
• I/O-Intensive Systems — Deploy in designs that require a high count of external interfaces, using the 316 available I/Os for board-level connectivity and peripheral expansion.

Unique Advantages

• High Logic Density: 43,661 logic elements enable implementation of complex logic functions on a single device, reducing component count.
• On-Chip Memory for Local Storage: Approximately 2.14 Mbits of embedded RAM support buffering and latency-sensitive data handling without external memory.
• Generous I/O Resources: 316 user I/Os simplify integration with sensors, actuators, and external controllers, minimizing need for additional I/O expanders.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in demanding environments typical of industrial deployments.
• Compact BGA Package: 484-ball BGA (484-FBGA, 23×23) provides a space-efficient footprint suitable for compact system boards while supporting surface-mount assembly.
• Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XC6SLX45-L1FGG484I?

The XC6SLX45-L1FGG484I delivers a balanced combination of logic capacity, embedded memory, and a high I/O count in an industrial-grade FPGA package. Its specification set makes it a practical choice for engineers building medium- to high-complexity embedded systems that require on-chip resources and reliable operation across a wide temperature range.

Backed by a known FPGA product family, this part is suited for teams seeking scalable hardware building blocks that consolidate functions onto a single IC, simplifying board-level design and supporting long-term availability for deployed systems.

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