XC6SLX45-L1CSG324C

The XC6SLX45-L1CSG324C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) from AMD, supplied in a 324‑pin LFBGA/CSPBGA package. It provides a balance of on‑chip logic, embedded RAM and I/O capacity suited for commercial embedded designs requiring reconfigurable logic resources.

With 43,661 logic elements, approximately 2.14 Mbits of embedded memory and 218 user I/Os, this device supports complex glue‑logic, custom peripherals and local buffering while fitting a compact surface‑mount 15×15 mm package footprint.

Key Features

• Logic Capacity  43,661 logic elements to implement custom digital functions, finite state machines and glue logic.
• Embedded Memory  Approximately 2.14 Mbits of on‑chip RAM for buffering, FIFOs and small data storage tasks.
• I/O Resources  218 general‑purpose I/O pins to interface with peripherals, buses and sensors directly from the FPGA fabric.
• Package & Mounting  324‑LFBGA (324‑CSPBGA, 15×15) surface‑mount package for compact board integration.
• Power  Core supply voltage range of 1.14 V to 1.26 V for predictable power budgeting.
• Operating Range & Grade  Commercial grade device rated for 0°C to 85°C operation.
• Environmental Compliance  RoHS‑compliant for regulatory and manufacturing alignment.

Typical Applications

• Prototyping and Development  Implement and iterate custom logic, peripheral controllers and proof‑of‑concept systems using plentiful logic elements and on‑chip RAM.
• I/O‑Intensive Embedded Systems  Manage multiple parallel interfaces and sensor buses using 218 I/O pins for board‑level integration.
• Local Data Buffering  Use the embedded RAM (≈2.14 Mbits) for packet buffering, small data caches or FIFO staging close to the logic.

Unique Advantages

• Substantial Logic Resources: 43,661 logic elements give designers headroom for sizeable custom functions without immediate migration to larger devices.
• On‑Chip Memory: Approximately 2.14 Mbits of embedded RAM reduces the need for external memory in many buffering and staging use cases.
• High I/O Count: 218 I/O pins enable direct interfacing to multiple peripherals and parallel buses, simplifying board design.
• Compact Surface‑Mount Package: 324‑CSPBGA (15×15) package provides a high‑density solution for space‑constrained PCBs.
• Predictable Power Envelope: Narrow core supply range (1.14 V–1.26 V) helps with power supply planning and thermal estimates.
• Commercial Temperature and RoHS Compliance: Rated for 0°C–85°C operation and RoHS‑compliant for mainstream commercial product development.

Why Choose XC6SLX45-L1CSG324C?

The XC6SLX45-L1CSG324C positions itself as a capable commercial FPGA option for designs that need substantial logic capacity, embedded memory and a high I/O count in a compact surface‑mount package. Its specification set supports a range of commercial embedded applications where on‑board integration, reconfigurability and predictable power requirements are important.

Engineers and procurement teams targeting scalable, reconfigurable designs will find value in the device’s combination of logic, memory and I/O resources, backed by AMD’s product family support and documentation.

Request a quote or submit an inquiry to obtain pricing and availability for the XC6SLX45-L1CSG324C.