XC6SLX45-3FGG484I

The XC6SLX45-3FGG484I is a Spartan®-6 LX field programmable gate array (FPGA) supplied in a 484-ball BGA package. It delivers a balanced combination of configurable logic, on-chip RAM, and I/O capacity for industrial-grade embedded and control applications.

Designed for systems that require mid-range logic density and flexible I/O, this FPGA supports operation across a wide industrial temperature range and low-voltage supply rails, enabling deployment in harsh environments and space-constrained designs.

Key Features

• Logic Capacity  Approximately 43,661 logic elements provide mid-range programmable logic for custom digital designs and protocol implementations.
• Configurable Logic Blocks (CLBs)  3,411 CLBs enable structured logic partitioning and modular design implementation.
• Embedded Memory  Approximately 2.14 Mbits of on-chip RAM support buffering, FIFOs, and small lookup tables without external memory.
• I/O Resources  316 user I/Os offer broad external connectivity for sensors, actuators, and peripheral interfaces.
• Power  Core supply range of 1.14 V to 1.26 V accommodates low-voltage system designs.
• Package and Mounting  484-ball BGA (supplier package: 484‑FBGA 23×23) in a surface-mount form factor for compact PCB layouts.
• Temperature Rating  Industrial operating range from −40°C to 100°C for reliable operation in demanding environments.
• Compliance  RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• Industrial Control  Use the FPGA for configurable control logic, motor control interface glue, or custom I/O aggregation in industrial systems that require an industrial temperature rating.
• Embedded Systems  Implement custom processing pipelines, protocol bridges, or peripheral controllers where on-chip RAM and logic density enable compact, integrated solutions.
• I/O-Intensive Designs  Leverage 316 user I/Os for applications that require extensive external device interfacing, signal routing, or parallel data acquisition.

Unique Advantages

• High Logic Density: 43,661 logic elements allow implementation of complex finite-state machines, custom datapaths, and control logic without external ASICs.
• Substantial On-Chip Memory: Approximately 2.14 Mbits of embedded RAM reduce or eliminate the need for external memory in many buffering and LUT use cases.
• Extensive I/O Count: 316 user I/Os provide flexibility for multi-channel interfacing and system expansion while simplifying board-level routing.
• Industrial Temperature Range: Rated from −40°C to 100°C for deployment in temperature-challenging environments and ruggedized equipment.
• Compact BGA Package: 484-ball FBGA (23×23) enables a small PCB footprint for space-constrained designs while maintaining signal density.
• RoHS Compliant: Meets RoHS requirements for environmentally compatible manufacturing and assembly.

Why Choose XC6SLX45-3FGG484I?

The XC6SLX45-3FGG484I positions itself as a mid-range Spartan‑6 LX FPGA that combines ample logic elements, embedded RAM, and a high I/O count in a compact BGA package. Its industrial temperature rating and low-voltage core range make it suitable for designers building robust, space-conscious systems that require configurable hardware functionality.

This device is well suited for engineers and procurement teams seeking a field-programmable solution that balances logic capacity, on-chip memory, and connectivity for industrial and embedded applications, delivering long-term design flexibility and integration potential.

Request a quote or submit an inquiry to evaluate XC6SLX45-3FGG484I for your next design project.