XC6SLX45-3FG484C

The XC6SLX45-3FG484C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) from AMD supplied in a 484-BBGA package. It combines substantial logic capacity with on-chip memory and a high I/O count for commercial-grade FPGA designs.

With 43,661 logic elements, approximately 2.14 Mbits of embedded memory, and 316 user I/Os, this device is intended for designers who need balanced logic density, memory resources, and connectivity in a surface-mount BGA package operating over a commercial temperature range.

Key Features

• Core Logic  43,661 logic elements provide programmable logic resources for implementing custom digital functions and control logic.
• Embedded Memory  Approximately 2.14 Mbits of on-chip RAM (2,138,112 bits) for buffering, state storage, and data manipulation.
• I/O Capacity  316 user I/Os to support substantial external device interfacing and parallel connectivity requirements.
• Power  Rated supply voltage range of 1.14 V to 1.26 V to match the device core requirements.
• Package & Mounting  484-BBGA package (supplier package: 484-FBGA, 23×23) in a surface-mount format for compact board integration.
• Operating Range & Grade  Commercial grade device specified for operation from 0°C to 85°C.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing considerations.
• Manufacturer  Produced by AMD.

Typical Applications

• Commercial FPGA designs  Used where a commercial-grade, surface-mount FPGA with balanced logic and memory resources is required.
• Logic-dense implementations  Applicable to projects needing tens of thousands of logic elements combined with on-chip RAM for control and data-path functions.
• I/O-centric systems  Suitable for designs that demand a high number of user I/Os for external interfacing within a compact BGA footprint.

Unique Advantages

• High logic capacity: 43,661 logic elements enable complex logic integration without immediate need for multi-FPGA partitioning.
• Substantial on-chip memory: Approximately 2.14 Mbits of embedded RAM supports buffering and local data storage to reduce external memory dependencies.
• Extensive I/O count: 316 user I/Os provide flexibility for parallel connections, sensor interfaces, and multiple peripherals.
• Compact BGA packaging: 484-BBGA / 484-FBGA (23×23) package allows dense board layouts while maintaining a large logic and I/O footprint.
• Commercial temperature suitability: Rated for 0°C to 85°C operation for a wide range of standard commercial environments.
• RoHS compliant: Meets environmental compliance requirements for modern electronic manufacturing.

Why Choose XC6SLX45-3FG484C?

The XC6SLX45-3FG484C positions itself as a commercial-grade FPGA option that combines a large pool of logic elements, meaningful on-chip memory, and a high I/O count in a compact surface-mount BGA package. These attributes make it suitable for designers who require a balanced platform for integrating custom digital logic, local memory buffering, and extensive external interfacing.

Backed by AMD as the manufacturer, this device provides a clear specification set—logic capacity, embedded memory, supply voltage window, package details, and operating temperature—that helps engineers evaluate fit-for-purpose integration into mid- to high-density commercial FPGA designs.

Request a quote or contact sales to obtain pricing and availability for the XC6SLX45-3FG484C and to discuss volume and delivery options.