XC6SLX45-3FG676I

The XC6SLX45-3FG676I is a Spartan®-6 LX field programmable gate array (FPGA) IC from AMD, offered in a 676-ball fine-pitch BGA package. This industrial-grade FPGA provides a mix of programmable logic, embedded memory, and flexible I/O for designs that require configurable hardware in demanding environments.

With a broad I/O count, a significant number of logic elements and on-chip RAM, and an extended operating temperature range, the device is positioned for industrial applications that need reliable, reprogrammable logic capacity with defined power and package characteristics.

Key Features

• Programmable Logic Approximately 43,661 logic elements to implement custom digital logic, state machines, and packet-processing functions.
• Embedded Memory Approximately 2.138 Mbits of on-chip RAM for buffering, FIFOs, and small data tables directly in the FPGA fabric.
• I/O Capability 358 user I/O pins to interface with external peripherals, sensors, and high-density board-level connections.
• Power Supply Core supply voltage range of 1.14 V to 1.26 V to match system power rails and ensure stable core operation.
• Package & Mounting 676-ball FBGA package (27 × 27 mm) in a surface-mount form factor suitable for compact, high-density PCB designs.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C, supporting deployment in extended-temperature industrial environments.
• Environmental Compliance RoHS compliant construction for regulatory and manufacturing compatibility.

Typical Applications

• Industrial Control — Utilize the device’s industrial temperature rating and abundant I/O to implement motor control, PLC logic, and automation interfaces.
• Embedded Processing — Deploy the programmable logic and on-chip RAM to accelerate custom data-paths and peripheral bridging in embedded systems.
• Communications & Networking — Use the large I/O count and logic capacity for protocol handling, packet buffering and I/O aggregation on communication boards.

Unique Advantages

• High logic density: Approximately 43,661 logic elements provide substantial programmable resources to consolidate multiple functions into a single device, reducing BOM complexity.
• On-chip memory: Roughly 2.138 Mbits of embedded RAM enables local buffering and low-latency data handling without external memory.
• Extensive I/O: 358 I/O pins support dense connectivity and simplify board-level routing for multi-peripheral designs.
• Industrial readiness: Rated for −40 °C to 100 °C operation and offered in a robust BGA package for long-term reliability in industrial settings.
• Compact board footprint: 676-FBGA (27 × 27 mm) surface-mount package delivers high integration in a space-efficient form factor.
• Regulatory compatibility: RoHS compliance supports streamlined manufacturing and environmental requirements.

Why Choose XC6SLX45-3FG676I?

The XC6SLX45-3FG676I combines substantial programmable logic capacity, embedded memory, and a high I/O count in an industrial-grade package, making it well suited for engineers who need a reprogrammable hardware platform that fits into compact, industrial system designs. Its defined supply voltage range and extended temperature rating help ensure predictable operation in demanding environments.

For design teams focused on scalability and robustness, this Spartan®-6 LX FPGA offers a balance of integration and flexibility backed by AMD’s FPGA family ecosystem and documentation.

Request a quote or submit a procurement inquiry to get pricing and availability for the XC6SLX45-3FG676I.