XC6SLX45-3FG484I

The XC6SLX45-3FG484I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC manufactured by AMD. It provides mid-range programmable logic resources in a compact ball grid array package targeted at industrial applications.

With 43,661 logic elements, approximately 2.14 Mbits of embedded memory, and 316 I/O pins, this device is suited for embedded control, signal processing, and I/O-rich designs that require an industrial operating temperature range and surface-mount packaging.

Key Features

• Core Logic 43,661 logic elements provide programmable combinational and sequential resources for custom digital functions.
• Embedded Memory Approximately 2.14 Mbits of on-chip RAM for buffering, state machines, and intermediate data storage.
• I/O Capability 316 user I/O pins to support multiple interfaces and external peripherals without external glue logic.
• Power Operates from a core supply range of 1.14 V to 1.26 V to match common FPGA power rails.
• Package & Assembly 484-BBGA package case with a supplier device package of 484-FBGA (23×23), optimized for surface-mount PCB assembly.
• Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Regulatory Compliance RoHS compliant to support lead-free manufacturing processes.

Typical Applications

• Industrial Control Implement motor control, PLC logic, and factory automation tasks using a device rated for industrial temperatures and extensive I/O.
• Embedded Signal Processing Use the combination of logic capacity and on-chip RAM for custom DSP pipelines, data buffering, and real-time processing.
• Interface Concentration Consolidate multiple peripheral interfaces and custom glue logic into a single FPGA thanks to 316 I/O pins.
• Prototyping and Product Development Mid-range logic density and a compact 484‑BGA package make the device suitable for development boards and final products that require surface-mount assembly.

Unique Advantages

• Substantial Logic Capacity: 43,661 logic elements enable implementation of complex finite-state machines, custom processors, and parallel pipelines without external ASICs.
• Significant On-chip Memory: Approximately 2.14 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary storage.
• High I/O Count: 316 I/O pins allow direct connection to sensors, actuators, and communication peripherals, simplifying board-level design.
• Industrial Temperature Rating: Operation from −40 °C to 100 °C supports deployment in demanding industrial environments.
• Compact BGA Packaging: 484‑BBGA / 484‑FBGA (23×23) footprint supports high-density PCB layouts while remaining compatible with surface-mount assembly processes.
• RoHS Compliant: Conforms to lead-free manufacturing requirements for modern production workflows.

Why Choose XC6SLX45-3FG484I?

The XC6SLX45-3FG484I balances mid-range programmable logic, substantial on-chip memory, and a high I/O count in a compact, industrial-rated BGA package. It is well suited to engineers and procurement teams seeking a robust FPGA platform for industrial embedded designs, interface consolidation, and signal processing tasks.

By combining verified operating limits, a defined core supply range, and RoHS compliance, this device offers a pragmatic option for designs that require reliable operation across temperature extremes and tightly integrated I/O and memory resources.

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