XC6SLX4-3CSG225I

The XC6SLX4-3CSG225I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD, offered in a 225-ball LFBGA/CSPBGA package. With approximately 3,840 logic elements, 132 user I/O and integrated on-chip memory, this industrial-grade device is designed for mid-density digital integration in constrained board footprints.

Its combination of logic capacity, I/O count and on-chip RAM makes it suitable for embedded and industrial applications that require configurable logic, deterministic interfacing and operation across a wide temperature range.

Key Features

• Logic Capacity  Approximately 3,840 logic elements for implementing mid-range combinational and sequential logic functions.
• Embedded Memory  Approximately 0.22 Mbits of on-chip RAM (221,184 bits) to support buffering, FIFOs and small data storage needs without external memory.
• General-Purpose I/O  132 user I/O pins to connect sensors, peripherals and external interfaces directly to the programmable fabric.
• Package and Mounting  225-ball LFBGA / 225-CSPBGA (13×13) package in a surface-mount form factor for compact board-level designs.
• Power  Core supply voltage range of 1.14 V to 1.26 V to match system power rails and power budgeting requirements.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for demanding environmental conditions.
• Compliance  RoHS compliant, meeting common environmental requirements for electronic assemblies.

Typical Applications

• Industrial Control  Programmable logic for control loops, signal conditioning and real-time decision logic operating across −40 °C to 100 °C.
• Embedded Processing  Mid-density logic and on-chip RAM suited for custom datapaths, protocol handling and peripheral aggregation in embedded systems.
• Sensor and I/O Integration  132 I/O pins enable direct interfacing with multiple sensors, ADC/DAC front ends and I/O buses for sensor hubs and data acquisition nodes.
• Communications Interfaces  Configurable logic for implementing protocol bridges, interface adaptation or pre-processing in communication endpoints.

Unique Advantages

• Balanced Logic and Memory:  Approximately 3,840 logic elements combined with ~0.22 Mbits of embedded RAM provides a compact platform for mid-complexity designs without immediate need for external memory.
• High I/O Density:  132 user I/O pins simplify peripheral integration and reduce the need for external multiplexing components.
• Industrial Reliability:  Rated for −40 °C to 100 °C operation to support deployment in temperature-challenging environments.
• Compact BGA Package:  225-LFBGA / 225-CSPBGA packaging enables high-density board layouts while maintaining a surface-mount footprint.
• Low-Voltage Core:  1.14 V to 1.26 V supply range supports contemporary power-rail architectures and efficient power planning.
• RoHS Compliant:  Meets environmental compliance requirements for lead-free assembly processes.

Why Choose XC6SLX4-3CSG225I?

The XC6SLX4-3CSG225I from AMD offers a balanced mix of logic, embedded RAM and I/O capability in a compact BGA package, making it well suited for mid-density programmable solutions in industrial and embedded applications. Its industrial temperature rating and RoHS compliance support deployment in environments where thermal range and environmental standards are important.

This part is appropriate for designers who need configurable hardware capacity, a substantial number of I/Os and on-chip memory in a surface-mount BGA form factor while operating from a low-voltage core supply.

Request a quote or submit an inquiry to receive pricing, availability and lead-time information for the XC6SLX4-3CSG225I.