XC6SLX4-3CPG196I

The XC6SLX4-3CPG196I is a Spartan®-6 LX field programmable gate array (FPGA) supplied in a 196-TFBGA (CSBGA) package. It provides a mid-range logic resource set with 3,840 logic elements, on-chip RAM, and a substantial complement of I/O for flexible system integration.

Designed for industrial environments, this device supports a wide operating temperature range and low-voltage core operation, enabling deployment in temperature-sensitive and space-constrained applications that require reprogrammable logic and interface consolidation.

Key Features

• Core Logic  Provides 3,840 logic elements for implementing custom digital logic, finite-state machines, and glue-logic functions.
• Embedded Memory  Includes 221,184 bits of on-chip RAM (approximately 0.22 Mbits) for buffering, FIFOs, and small data storage.
• I/O Capacity  106 user I/O pins to support multiple interfaces and peripheral connections without external multiplexers.
• Power  Core supply range of 1.14 V to 1.26 V for low-voltage system designs.
• Package & Mounting  Delivered in a 196-TFBGA (196-CSPBGA 8×8) package suitable for surface-mount assembly in compact board layouts.
• Temperature & Grade  Industrial-grade device rated for operation from −40°C to 100°C for use in temperature-challenging environments.
• Environmental Compliance  RoHS-compliant manufacturing to meet common environmental requirements.

Typical Applications

• Embedded Control and Interface  Use the device's 3,840 logic elements and 106 I/O to implement control algorithms, protocol bridging, and board-level interface glue.
• Industrial Automation  Industrial-grade temperature range and robust packaging make it suitable for automation controllers and factory instrumentation.
• Data Buffering and Timing Logic  On-chip RAM (approximately 0.22 Mbits) supports buffering, FIFO implementation, and timing management in mid-density designs.

Unique Advantages

• Balanced Logic Density:  3,840 logic elements provide a mid-level resource pool that fits many moderate-complexity FPGA tasks without overspecifying the design.
• Integrated Memory:  On-chip RAM reduces the need for external memory for small data storage and buffering, simplifying PCB layout and BOM.
• Flexible I/O Count:  106 I/O pins enable multiple peripheral connections and interface implementations directly from the device.
• Industrial Temperature Rating:  Rated from −40°C to 100°C to support deployments in harsher environmental conditions.
• Low-Voltage Core Operation:  1.14 V to 1.26 V core supply supports compatibility with low-voltage power rails and can help reduce system power consumption.
• Compact Package:  196-TFBGA (8×8 CSPBGA) package facilitates space-constrained board designs while maintaining required I/O and logic resources.

Why Choose XC6SLX4-3CPG196I?

The XC6SLX4-3CPG196I is positioned for designs that require a reliable, mid-density FPGA with a solid mix of logic, memory, and I/O resources in a compact BGA package. Its industrial temperature rating and RoHS compliance make it appropriate for applications where environmental resilience and regulatory conformity matter.

This device is well suited to engineers and teams building control, interface, and buffering functions that benefit from reprogrammable logic and integrated memory while operating within low-voltage power budgets and constrained board area.

If you would like pricing or availability, request a quote or submit an inquiry to receive a formal quotation and lead-time information.