XC6SLX4-3CPG196C

IC FPGA 106 I/O 196CSBGA
Part Description

Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 106 221184 3840 196-TFBGA, CSBGA

Quantity 27 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package196-CSPBGA (8x8)GradeCommercialOperating Temperature0°C – 85°C
Package / Case196-TFBGA, CSBGANumber of I/O106Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs300Number of Logic Elements/Cells3840
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits221184

Overview of XC6SLX4-3CPG196C – Spartan®-6 LX FPGA, 196-TFBGA

The XC6SLX4-3CPG196C is a Spartan®-6 LX field programmable gate array (FPGA) from AMD presented in a 196-TFBGA (CSBGA) surface-mount package. It provides 3,840 logic elements, approximately 0.22 Mbits of embedded memory, and 106 user I/Os for commercial-grade programmable-logic designs.

Designed for commercial applications, the device operates from a supply range of 1.14 V to 1.26 V, supports an ambient temperature range of 0 °C to 85 °C, and is RoHS compliant.

Key Features

  • Core Logic  3,840 logic elements for implementing custom digital logic functions and control schemes.
  • Embedded Memory  Approximately 0.22 Mbits (221,184 bits) of on-chip RAM to support buffers, FIFOs, and small data stores.
  • I/O Capacity  106 general-purpose I/Os to interface with peripherals, sensors, and board-level signals.
  • Power  Operates from a 1.14 V to 1.26 V supply range to match system power rails within that window.
  • Package & Mounting  196-TFBGA (CSBGA) package in a surface-mount format; supplier package noted as 196-CSPBGA (8×8).
  • Temperature & Grade  Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
  • Environmental  RoHS compliant for environmentally restricted designs.

Typical Applications

  • Commercial embedded systems  Use the FPGA’s 3,840 logic elements and on-chip RAM to implement custom control, data-processing, or glue-logic functions in commercial products.
  • I/O aggregation and protocol bridging  The 106 I/Os enable consolidation of multiple peripheral interfaces and board-level signal routing in a compact BGA footprint.
  • Surface-mount board designs  The 196-TFBGA package supports high-density, surface-mount PCB assemblies for space-constrained commercial equipment.

Unique Advantages

  • Balanced logic and memory  Combines 3,840 logic elements with approximately 0.22 Mbits of embedded RAM to support modest logic and buffering needs without external memory.
  • Ample I/O in a compact package  106 user I/Os in a 196-TFBGA footprint enable flexible interfacing while maintaining a small board area.
  • Commercial-grade suitability  Rated for 0 °C to 85 °C operation and designated as a commercial-grade device for mainstream product lines.
  • RoHS compliant  Meets RoHS requirements for environmentally constrained designs.
  • Low-voltage operation  Operates within a defined 1.14 V–1.26 V supply window to align with specific power-rail architectures.

Why Choose XC6SLX4-3CPG196C?

The XC6SLX4-3CPG196C offers a compact, commercial-grade Spartan®-6 LX FPGA option with a clear balance of logic capacity, embedded memory, and I/O count in a 196-TFBGA surface-mount package. Its specified supply voltage and operating temperature range make it suitable for mainstream commercial board-level designs where moderate programmable logic and on-chip RAM are required.

As a member of the Spartan®-6 family from AMD, this device provides a defined set of resources for designers seeking a predictable, RoHS-compliant FPGA footprint with 3,840 logic elements and 106 I/Os.

If you would like pricing, availability, or a formal quote for the XC6SLX4-3CPG196C, submit a quote request or inquiry to receive current commercial information and lead-time details.

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