XC6SLX4-2CSG225C

The XC6SLX4-2CSG225C is a Spartan®-6 LX field programmable gate array (FPGA) supplied in a 225-LFBGA (13×13) CSPBGA surface-mount package. It provides 3,840 logic elements, approximately 0.22 Mbits of embedded memory, and 132 I/O pins in a compact commercial-grade device.

Designed for commercial applications, this device offers a balance of logic capacity, on-chip RAM, and I/O density for compact embedded designs that operate within a 1.14 V to 1.26 V supply range and a 0 °C to 85 °C temperature window.

Key Features

• Logic Capacity 3,840 logic elements for implementing custom digital functions and moderate-complexity logic designs.
• Embedded Memory Approximately 0.22 Mbits (221,184 bits) of on-chip RAM to support buffers, state machines, and small data storage needs.
• I/O Resources 132 general-purpose I/O pins to interface with peripherals, sensors, and external logic.
• Power Supply Operates from a core voltage supply range of 1.14 V to 1.26 V.
• Package & Mounting 225-LFBGA (13×13) CSPBGA package, surface-mount mounting type for dense PCB integration.
• Temperature & Grade Commercial grade device rated for operation from 0 °C to 85 °C.
• Regulatory RoHS compliant, meeting common environmental requirements for electronic manufacturing.

Typical Applications

• Commercial Embedded Systems Implement custom control logic and signal processing where a moderate logic count and on-chip RAM suffice for system functions.
• I/O Expansion and Interface Bridging Use the 132 I/O pins to connect multiple peripherals or perform protocol translation within a compact package.
• Compact Board Designs The 225-LFBGA surface-mount package supports space-constrained PCBs requiring a balance of logic, memory, and I/O.

Unique Advantages

• Balanced Logic and Memory: 3,840 logic elements paired with approximately 0.22 Mbits of embedded RAM enable a range of moderate-complexity designs without external memory.
• High I/O Count in a Small Footprint: 132 I/O pins in a 225-LFBGA package provide substantial connectivity while preserving board real estate.
• Commercial Temperature Rating: Rated 0 °C to 85 °C for reliable operation in standard commercial environments.
• Compact Surface-Mount Packaging: 225-CSPBGA (13×13) simplifies placement on modern PCBs and supports automated assembly.
• RoHS Compliant: Environmentally compliant for use in lead-free manufacturing processes.

Why Choose XC6SLX4-2CSG225C?

The XC6SLX4-2CSG225C delivers a practical combination of logic density, embedded memory, and I/O capacity in a compact 225-LFBGA surface-mount package for commercial-grade applications. Its defined supply voltage range and operating temperature make it suitable for a wide range of standard embedded designs that require reliable, moderate-capacity FPGA resources.

Engineers and procurement teams will find this device appropriate for projects that need a controlled balance of performance and integration while maintaining compliance with RoHS requirements and standard commercial operating conditions.

Request a quote or submit an inquiry to obtain pricing, availability, and evaluation support for the XC6SLX4-2CSG225C. Our team can assist with lead times and order placement.