XC6SLX25T-N3FGG484C

The XC6SLX25T-N3FGG484C is a Spartan®-6 LXT field-programmable gate array (FPGA) IC from AMD. It provides a balance of programmable logic, on-chip RAM and a large I/O count in a compact BGA package for commercial-grade designs.

With 24,051 logic elements, approximately 0.96 Mbits of embedded memory and 250 user I/O, this device addresses applications that require flexible logic implementation, embedded memory resources and dense I/O connectivity within a surface-mount 484-BBGA footprint.

Key Features

• Core Logic — 24,051 logic elements and 1,879 configurable logic blocks (CLBs) for implementing custom digital logic and control functions.
• Embedded Memory — Approximately 0.96 Mbits (958,464 bits) of on-chip RAM to support buffering, state machines and small data structures without external memory.
• I/O Density — 250 user I/O pins to support multiple interfaces, parallel connections and board-level integration.
• Power — Nominal core voltage range of 1.14 V to 1.26 V to match system power-rail requirements.
• Package & Mounting — 484-BBGA (supplier package 484-FBGA, 23×23) in a surface-mount format for compact PCB layouts.
• Operating Conditions — Commercial-grade operation from 0 °C to 85 °C for typical business and consumer environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Embedded Control — Implement custom control logic and state machines using on-chip logic and RAM for compact embedded systems.
• Interface Bridging — Use the 250 I/O pins to connect and bridge multiple peripheral interfaces on a single device.
• Prototyping & Development — Evaluate and iterate digital designs with a commercially graded FPGA that supports reprogrammable logic and memory.
• Compact PCB Designs — Leverage the 484-BBGA surface-mount package for high-density board layouts where space is constrained.

Unique Advantages

• Generous Logic Capacity: 24,051 logic elements and 1,879 CLBs enable implementation of substantial custom digital functions without partitioning across multiple devices.
• On-chip Memory: Approximately 0.96 Mbits of embedded RAM reduces reliance on external memory for buffering and small data stores, simplifying BOM and layout.
• High I/O Count: 250 user I/Os provide flexibility to connect multiple peripherals, sensors and parallel interfaces directly to the FPGA.
• Compact, Surface-Mount Package: The 484-BBGA (23×23) package supports compact PCB designs while maintaining a high pin count for system integration.
• Commercial Temperature Range: Rated 0 °C to 85 °C to meet typical commercial application requirements.
• Regulatory Compliance: RoHS compliance supports use in designs targeting markets with environmental restrictions on hazardous substances.

Why Choose XC6SLX25T-N3FGG484C?

The XC6SLX25T-N3FGG484C delivers a balanced combination of logic density, embedded memory and I/O capacity in a compact surface-mount BGA package, making it suitable for commercial embedded designs that require flexible, reprogrammable logic. Its specified core voltage range and operating temperature align with standard commercial system requirements.

This device is a practical choice for engineers and procurement teams seeking a well-specified Spartan®-6 LXT FPGA for development, prototyping and volume applications where on-chip resources and high I/O count reduce external component needs and simplify board-level integration.

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