XC6SLX25T-N3FG484C

The XC6SLX25T-N3FG484C is a Spartan®-6 LXT field programmable gate array (FPGA) IC provided in a 484-BBGA surface-mount package. Its on-chip resources include 24,051 logic elements, 1,879 CLBs, approximately 0.958 Mbits of embedded memory, and 250 user I/O pins—delivering a compact, reprogrammable logic fabric for commercial electronic designs.

Designed for commercial-grade applications, the device operates across a 1.14 V to 1.26 V supply range and a 0 °C to 85 °C temperature range, and is RoHS compliant. The 484-FBGA (23×23) package supports dense integration in space-constrained board layouts.

Key Features

• Core Logic  24,051 logic elements and 1,879 CLBs provide a substantial configurable fabric for implementing custom digital logic and control functions.
• Embedded Memory  Approximately 0.958 Mbits of on-chip RAM supports data buffering, small lookup tables, and state storage without external memory.
• I/O Density  250 user I/O pins enable broad interfacing options for peripherals, sensors, and external devices.
• Power Supply  Operates from a 1.14 V to 1.26 V core supply range, suited to designs targeting low-voltage FPGA operation.
• Package and Mounting  484-BBGA (supplier package 484-FBGA, 23×23) in a surface-mount configuration supports compact PCB layouts and automated assembly.
• Commercial Grade and Temperature Range  Rated for commercial use with an operating temperature range of 0 °C to 85 °C to match typical commercial electronics environments.
• Environmental Compliance  RoHS compliant for adherence to common environmental material requirements.

Typical Applications

• Commercial Electronic Systems  Use the FPGA’s logic density and 250 I/O pins to implement custom control, glue logic, or protocol bridging in commercial products.
• Embedded Processing and Acceleration  Leverage on-chip RAM and CLBs for offloading specific processing tasks or for hardware-accelerated functions within embedded designs.
• Prototyping and Development Platforms  The reprogrammable Spartan®-6 fabric and accessible I/O count make this part suitable for iterative design and prototyping of digital systems.

Unique Advantages

• Substantial Logic Capacity: 24,051 logic elements and 1,879 CLBs provide the headroom to implement complex combinational and sequential logic without immediate external ASIC development.
• On‑Chip Memory Integration: Approximately 0.958 Mbits of embedded RAM reduces reliance on external memory for small buffers and state storage, simplifying BOM and board routing.
• High I/O Count: 250 user I/Os enable versatile interfacing options, reducing the need for additional interface chips.
• Compact, Surface‑Mount Package: The 484-BBGA (23×23) package delivers high integration density for space-constrained PCBs and supports standard surface-mount assembly.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for deployment in commercial-grade electronics while meeting environmental material standards.

Why Choose XC6SLX25T-N3FG484C?

The XC6SLX25T-N3FG484C positions itself as a versatile, commercially rated FPGA that combines a sizable logic fabric, embedded memory, and a high I/O count within a compact 484-BBGA surface-mount package. Its defined core voltage window and commercial temperature rating make it suitable for a wide range of commercial electronic designs where reprogrammable logic and dense I/O are required.

This device is well suited to engineers and teams seeking a reconfigurable solution that balances integration and board-space efficiency while remaining compliant with RoHS requirements. Its resource mix supports iterative development, custom logic implementation, and on-chip buffering without immediately adding external components.

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