XC6SLX4-2CPG196I

The XC6SLX4-2CPG196I is a Spartan®-6 LX field programmable gate array (FPGA) in a compact 196‑TFBGA / CSBGA package. It delivers a balance of programmable logic capacity, on-chip memory, and I/O density for industrial embedded designs requiring a small-footprint, surface-mount FPGA.

Key hardware attributes include 3,840 logic elements, approximately 0.22 Mbits of embedded RAM, 106 I/Os, an industrial operating temperature range, and a low-voltage core supply range—making it suitable for a variety of industrial and embedded applications.

Key Features

• Logic Capacity  3,840 logic elements provide programmable logic resources for moderate-complexity digital functions and custom logic implementation.
• Embedded Memory  Approximately 0.22 Mbits of on-chip RAM (221,184 total bits) for buffering, small data tables, and state storage without external memory.
• I/O Density  106 general-purpose I/Os support a variety of peripheral interfaces and signal routing directly from the FPGA.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match modern low-voltage system power domains.
• Package & Mounting  196‑TFBGA (CSBGA) package; supplier device package listed as 196‑CSPBGA (8×8). Surface-mount mounting for compact PCB integration.
• Industrial Grade & Temperature  Rated for industrial use with an operating temperature range of −40 °C to 100 °C for deployment in harsh environments.
• Regulatory  RoHS-compliant construction.

Typical Applications

• Industrial Automation  Use the industrial-grade temperature range and 106 I/Os to implement control logic, sensor interfacing, and real-time I/O aggregation in factory equipment.
• Embedded Control  Leverage 3,840 logic elements and on-chip RAM to build compact embedded controllers and custom processing blocks for instrumentation and machinery.
• I/O Bridging and Protocol Conversion  Deploy the FPGA’s I/O resources to implement protocol translation, signal conditioning, and interface bridging in constrained PCB area.
• Compact FPGA Designs  The 196‑TFBGA surface-mount package enables small-footprint implementations where board space and industrial reliability are priorities.

Unique Advantages

• Compact, manufacturable package: A 196‑TFBGA surface-mount footprint simplifies PCB layout for space-constrained boards while supporting reliable assembly.
• Industrial temperature capability: −40 °C to 100 °C rating supports deployment in environments with wide temperature variation.
• Good I/O integration: 106 I/Os reduce the need for external interface components and simplify board-level connectivity.
• Low-voltage core: 1.14 V–1.26 V supply range aligns with modern low-voltage power domains to help optimize system power architecture.
• On-chip memory: Approximately 0.22 Mbits of embedded RAM provides local buffering and storage for control logic without external memory.
• RoHS compliance: Environmentally compliant construction for regulatory consistency in product manufacturing.

Why Choose XC6SLX4-2CPG196I?

The XC6SLX4-2CPG196I combines a Spartan®-6 LX FPGA’s programmable logic capacity with a compact 196‑TFBGA package and industrial temperature rating, delivering a practical option for engineers who need moderate logic resources, substantial I/O, and on-chip memory in a surface-mount form factor. Its low-voltage core and RoHS compliance further align it with modern embedded power and manufacturing requirements.

This device is well suited to teams designing industrial embedded systems, compact control modules, and I/O-centric FPGA implementations that require reliable operation across a wide temperature range and a small PCB footprint.

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