XC6SLX25T-N3CSG324I

The XC6SLX25T-N3CSG324I is a Spartan®-6 LXT field programmable gate array (FPGA) in a 324-pin LFBGA/CSPBGA package. It provides a balance of logic capacity, on-chip memory, and I/O for industrial applications that require configurable digital logic and flexible interfacing.

With 24,051 logic elements, approximately 0.96 Mbits of embedded memory and 190 user I/O, this device targets embedded systems and industrial control designs that need moderate logic density, substantial local RAM, and a broad I/O footprint while operating across an industrial temperature range.

Key Features

• Core Logic  Provides 24,051 logic elements and 1,879 CLBs for implementing combinational and sequential logic, state machines, and glue logic.
• Embedded Memory  Approximately 0.96 Mbits of on-chip RAM to support buffering, FIFOs, and small data storage needs without external memory.
• I/O Capacity  190 user I/O pins to support parallel interfaces, sensor connections, and peripheral control in compact systems.
• Power and Voltage  Core voltage supply range of 1.14 V to 1.26 V for the device core.
• Package & Mounting  324-LFBGA (supplier package: 324-CSPBGA, 15×15) in a surface-mount form factor for space-efficient PCB layouts.
• Industrial Grade Operation  Rated to operate from −40 °C to 100 °C, suitable for industrial environments.
• RoHS Compliance  Material compliance aligned with RoHS requirements.

Typical Applications

• Industrial Control  Use the device’s 190 I/O and industrial temperature range for sensor interfacing, I/O aggregation, and control logic in automation systems.
• Embedded Signal Processing  Leverage 24,051 logic elements and on-chip RAM for data path control, protocol handling, and mid-level signal processing tasks.
• Interface Bridging  Deploy the FPGA to implement protocol translation and glue logic between disparate digital interfaces within compact hardware designs.

Unique Advantages

• High Logic Density: 24,051 logic elements provide the capacity to implement complex finite-state machines and custom accelerators without external logic.
• Meaningful On-Chip Memory: Approximately 0.96 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary data storage.
• Large I/O Count: 190 I/O pins enable broad peripheral connectivity and flexible board-level partitioning.
• Compact Surface-Mount Package: The 324-LFBGA / 324-CSPBGA (15×15) package supports space-constrained PCB designs while providing robust pin density.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in harsh or temperature-variable environments.
• Low-Voltage Core: The 1.14 V to 1.26 V supply range supports integration into modern low-voltage power architectures.

Why Choose XC6SLX25T-N3CSG324I?

The XC6SLX25T-N3CSG324I positions itself as a practical FPGA option for designers needing a balanced mix of logic capacity, embedded memory, and I/O density in an industrial-grade package. Its combination of 24k logic elements, nearly 1 Mbit of internal RAM, and 190 I/O pins enables compact, versatile designs for industrial control, embedded processing, and interface tasks.

This device delivers a scalable hardware building block for projects that benefit from on-chip configurability, a high pin count in a 15×15 CSPBGA footprint, and operation across industrial temperature extremes, offering long-term suitability for deployment in rugged environments.

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