XC6SLX25T-N3CSG324C

The XC6SLX25T-N3CSG324C is a Spartan®-6 LXT field programmable gate array (FPGA) IC from AMD. It provides a balance of logic capacity, on-chip memory, and I/O resources in a 324-ball CSPBGA package for commercial-grade embedded designs.

Key on-chip resources include 24,051 logic elements, 1,879 configurable logic blocks (CLBs), approximately 0.96 Mbits of embedded memory, and 190 I/O pins. The device operates from a 1.14 V to 1.26 V supply and is rated for 0 °C to 85 °C operating temperature.

Key Features

• Core Logic  1,879 configurable logic blocks (CLBs) delivering 24,051 logic elements for implementing custom digital functions and control logic.
• Embedded Memory  Approximately 0.96 Mbits of on-chip RAM, suitable for buffering, small data stores, and control-state memory.
• I/O Resources  190 available I/O pins to support multiple parallel interfaces and external device connectivity.
• Power  Narrow core supply range of 1.14 V to 1.26 V for the device core voltage requirements.
• Package and Mounting  Supplied in a 324-ball LFBGA/CSPBGA package (Supplier Device Package: 324-CSPBGA (15x15)) for surface-mount assembly.
• Operating Range  Commercial grade device specified for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density I/O control  Use when designs require up to 190 selectable I/O signals for interfacing with peripherals and external logic.
• Logic-intensive embedded functions  Suitable for implementing custom digital functions that require approximately 24,051 logic elements and 1,879 CLBs.
• On-chip buffering and small data storage  The approximately 0.96 Mbits of embedded RAM supports localized buffering, FIFOs, and small memory structures.

Unique Advantages

• Balanced logic and memory capacity: Combines 24,051 logic elements with about 0.96 Mbits of embedded RAM to handle logic and data storage on a single device.
• Generous I/O count: 190 I/O pins provide flexibility for parallel interfaces, external control signals, and mixed-signal connectivity strategies.
• Compact surface-mount package: The 324-CSPBGA (15x15) package supports dense board designs while maintaining necessary ball count for complex implementations.
• Commercial operating range: Specified for 0 °C to 85 °C operation to match commercial embedded system requirements.
• RoHS compliant: Environmental compliance simplifies regulatory considerations for commercial products.

Why Choose XC6SLX25T-N3CSG324C?

The XC6SLX25T-N3CSG324C positions itself as a balanced FPGA solution for commercial embedded designs that need a combination of logic density, embedded memory, and a high I/O count in a compact surface-mount package. Its specification set—24,051 logic elements, 1,879 CLBs, approximately 0.96 Mbits of RAM, and 190 I/Os—makes it suitable for applications where localized processing, interface aggregation, and custom control logic are required.

This Spartan®-6 LXT device is appropriate for engineering teams designing compact, commercially rated systems that require on-chip programmability, a defined core voltage range (1.14 V–1.26 V), and RoHS compliance for broader market acceptance.

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