XC6SLX25T-3FGG484C

The XC6SLX25T-3FGG484C is a Spartan®-6 LXT field programmable gate array (FPGA) IC from AMD. It delivers programmable logic capacity and embedded memory in a compact 484-ball BGA package for commercial-grade electronic designs.

Key on-chip resources include 24,051 logic elements and approximately 0.96 Mbits of embedded memory, with up to 250 I/Os and a low-voltage core supply range of 1.14 V to 1.26 V. The device is RoHS compliant and specified for commercial operating temperatures.

Key Features

• Logic Capacity — 24,051 logic elements provide programmable resources for implementing custom digital functions and logic blocks.
• Embedded Memory — Approximately 0.96 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
• I/O Resources — Up to 250 general-purpose I/Os to interface with peripherals, sensors, and external logic.
• Power — Core voltage supply specified from 1.14 V to 1.26 V to match system power domains and enable low-voltage operation.
• Package & Mounting — 484-BBGA package (supplier device package: 484-FBGA, 23×23); surface-mount component suitable for compact PCB layouts.
• Operating Conditions — Commercial grade device rated for 0 °C to 85 °C operating temperature range.
• Environmental Compliance — RoHS compliant for reduced hazardous substances in manufacturing.

Typical Applications

• Embedded Control — Implement custom control logic and state machines using on-chip logic elements and memory for commercial embedded products.
• I/O Bridging and Interface — Use the available 250 I/Os for parallel and serial interfacing between subsystems and peripherals.
• Prototyping and Development — Leverage programmable logic density and embedded RAM for proof-of-concept designs and feature validation.
• Compact Product Designs — The 484-BBGA package and surface-mount mounting enable dense PCB integration in space-constrained commercial applications.

Unique Advantages

• Substantial Logic Density: 24,051 logic elements provide a strong foundation for mid-sized digital designs without immediate need for external PLDs.
• On-Chip Memory Availability: Approximately 0.96 Mbits of embedded RAM reduces reliance on external memory for buffering and local storage.
• High I/O Count: 250 I/Os give flexibility to connect multiple peripherals, sensors, and interfaces directly to the FPGA.
• Compact BGA Packaging: The 484-ball BGA (484-FBGA, 23×23) supports compact PCB layouts while maintaining ample I/O and core resources.
• Commercial Temperature Rating: Specified 0 °C to 85 °C operation aligns with a broad range of commercial electronic products.
• RoHS Compliant: Meets environmental requirements for restricted substances in electronic manufacturing.

Why Choose XC6SLX25T-3FGG484C?

The XC6SLX25T-3FGG484C balances programmable logic capacity, on-chip memory, and a generous I/O count in a compact surface-mount BGA package. Its specifications make it well-suited for commercial electronic designs that require embedded logic, flexible interfacing, and reduced external component count.

Manufactured by AMD and available in a standard commercial temperature range with RoHS compliance, this FPGA offers a pragmatic option for teams building compact, programmable systems that demand moderate logic and memory resources.

Request a quote or submit an inquiry to receive pricing and availability for the XC6SLX25T-3FGG484C.