XC6SLX25T-3FG484I

The XC6SLX25T-3FG484I is a Spartan®-6 LXT FPGA from AMD, provided in a 484-ball BGA package for surface-mount applications. It combines substantial logic capacity, embedded RAM, and a high I/O count to support custom digital designs and I/O-intensive implementations.

This industrial-grade device supports a supply voltage range of 1.14 V to 1.26 V and an operating temperature range of -40 °C to 100 °C, and is RoHS compliant.

Key Features

• Logic Capacity  24,051 logic elements to implement custom digital functions and user logic.
• Embedded Memory  Approximately 0.96 Mbits of on-chip RAM for buffering, FIFOs and small data storage.
• I/O Resources  250 general-purpose I/O pins to support broad peripheral and interface connectivity.
• Power  Core supply voltage range of 1.14 V to 1.26 V for defined power budgeting and design margins.
• Package and Mounting  484-BBGA (supplier package: 484-FBGA, 23×23) in a surface-mount footprint for compact board integration.
• Industrial Temperature & Grade  Rated industrial grade with an operating range of -40 °C to 100 °C for deployment in demanding environments.
• Environmental Compliance  RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Custom digital logic  Implement application-specific processing and control logic using the device's 24,051 logic elements and embedded RAM.
• I/O aggregation and protocol bridging  Use the 250 I/Os to consolidate peripherals and bridge interfaces between subsystems.
• Embedded system prototyping  Leverage the FPGA's configurable resources and on-chip memory to prototype and validate custom IP and system functions.

Unique Advantages

• Substantial programmable logic: 24,051 logic elements enable complex custom logic implementations without external ASICs.
• On-chip memory for data handling: Approximately 0.96 Mbits of embedded RAM reduces external memory dependency for mid-sized buffering and state storage.
• High I/O count: 250 I/Os provide flexible interface options for sensors, peripherals, and board-level integration.
• Industrial-ready thermal range: Rated from -40 °C to 100 °C to support deployment in temperature-challenging environments.
• Compact BGA footprint: 484-ball BGA (23×23) surface-mount package supports high-density PCB designs.
• RoHS compliant: Aligned with common environmental requirements for modern electronic products.

Why Choose XC6SLX25T-3FG484I?

The XC6SLX25T-3FG484I delivers a balanced combination of programmable logic density, embedded memory, and a high I/O count in a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for projects requiring reliable operation across a wide thermal range.

Designed for engineers and teams building custom digital systems, I/O-centric interfaces, and prototypes, this Spartan®-6 LXT device provides predictable, verifiable resources from a recognized FPGA family and manufacturer.

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