XC6SLX25T-3CSG324C

The XC6SLX25T-3CSG324C is a Spartan®-6 LXT field programmable gate array (FPGA) from AMD delivered in a 324-LFBGA (324-CSPBGA, 15×15) surface-mount package. It provides a mid-range programmable logic resource set with integrated on-chip RAM and a broad I/O count suitable for commercial embedded designs.

Typical use cases include configurable digital logic, on-board protocol bridging, and designs that require a combination of logic density, embedded memory, and flexible I/O in a compact surface-mount package.

Key Features

• Core Logic 24,051 logic elements to implement a wide range of custom digital functions and state machines.
• Logic Blocks 1,879 logic block resources for structured logic partitioning and mapping.
• Embedded Memory 958,464 bits (approximately 0.96 Mbits) of on-chip RAM for data buffering, FIFOs, and small lookup tables.
• I/O Capacity 190 user I/O pins to support multiple external interfaces and parallel connections.
• Power Supported core supply voltage range of 1.14 V to 1.26 V for power planning and regulator selection.
• Package & Mounting 324-LFBGA (324-CSPBGA, 15×15) surface-mount package for compact board integration.
• Operating Range & Grade Commercial grade operation with an operating temperature range of 0°C to 85°C.
• Compliance RoHS compliant to meet lead-free manufacturing requirements.

Typical Applications

• Embedded Control and Logic — Implement custom finite-state machines, glue logic, and application-specific datapaths using on-chip logic and memory.
• Protocol Bridging — Use the device's abundant I/O to interface between multiple serial and parallel buses or legacy and modern peripherals.
• Prototyping and Development — Deploy as a compact programmable platform for validating algorithms and digital designs before production.
• Data Buffering and Local Memory — Leverage approximately 0.96 Mbits of on-chip RAM for buffering, FIFOs, and temporary storage within embedded applications.

Unique Advantages

• Significant Logic Capacity: 24,051 logic elements allow substantial custom logic implementation without external ASICs.
• Generous I/O Count: 190 I/O pins support multiple interfaces and parallel data paths, reducing the need for external I/O expanders.
• Integrated On-Chip RAM: Nearly 1 Mbit of embedded memory simplifies designs that require local buffering and low-latency storage.
• Compact Surface-Mount Package: 324-LFBGA (15×15 CSPBGA) enables dense board layouts and space-constrained designs.
• Commercial Temperature Suitability: Rated for 0°C to 85°C operation for a wide range of standard commercial applications.
• RoHS Compliant: Meets lead-free manufacturing requirements for modern production processes.

Why Choose XC6SLX25T-3CSG324C?

The XC6SLX25T-3CSG324C offers a balanced combination of mid-range logic density, embedded memory, and extensive I/O in a compact 324-LFBGA surface-mount package. As a commercial-grade Spartan®-6 LXT FPGA from AMD, it suits designs that require configurable logic resources, local RAM, and flexible interface options without moving to higher-cost device families.

Choose this device when you need a programmable solution that delivers measurable logic capacity, substantial on-chip RAM, and a high I/O count while maintaining RoHS compliance and standard commercial temperature operation.

Request a quote or submit a request to receive pricing and availability for the XC6SLX25T-3CSG324C. Our team will respond with a formal quote and procurement details.