XC6SLX25T-2FG484C

The XC6SLX25T-2FG484C is a Spartan®-6 LXT field programmable gate array (FPGA) IC from AMD. It provides on-chip programmable logic and memory resources in a 484-ball BGA package for commercial-grade embedded and digital designs.

Key Features

• Logic Capacity 24,051 logic elements and 1,879 configurable logic blocks (CLBs) for implementing custom digital logic and state machines.
• Embedded Memory Approximately 0.96 Mbits of on-chip RAM (958,464 total RAM bits) to support buffering, lookup tables, and small data stores.
• I/O Count 250 user I/O pins to interface with peripherals, sensors, and other system components.
• Power Core supply voltage range of 1.14 V to 1.26 V to match typical low-voltage FPGA power rails.
• Package and Mounting 484-ball BGA (supplier package: 484-FBGA, 23×23) in a surface-mount form factor for compact board placement.
• Operating Range Commercial grade operation from 0 °C to 85 °C suitable for standard consumer and industrial-environment applications.
• Compliance RoHS compliant, meeting standard environmental regulations for lead-free assembly.

Typical Applications

• Embedded Systems Use as the programmable logic core for custom control, protocol bridging, or glue logic in embedded designs.
• Prototyping and Development Suitable for hardware prototyping and iterative design where reconfigurable logic and on-chip memory accelerate development cycles.
• Communications Interfaces Implement custom I/O protocols and interface logic leveraging the device's high I/O count.
• Consumer and Commercial Electronics Integrate into devices that require a compact, surface-mount FPGA solution with moderate logic and memory capacity.

Unique Advantages

• Scalable Logic Resource: 24,051 logic elements support moderate-complexity designs without excessive BOM complexity.
• On-Chip Memory: Nearly 1 Mbit of embedded RAM reduces external memory needs for buffering and LUT-based functions.
• High I/O Density: 250 user I/Os enable flexible interfacing to multiple peripherals and subsystems from a single device.
• Compact BGA Package: 484-ball FBGA (23×23) saves PCB space while supporting surface-mount assembly processes.
• Commercial Temperature Rating: Rated 0 °C to 85 °C to match typical commercial application environments.
• RoHS Compliant: Meets lead-free environmental requirements for modern manufacturing.

Why Choose XC6SLX25T-2FG484C?

The XC6SLX25T-2FG484C delivers a balanced combination of logic capacity, embedded memory, and I/O density in a compact 484-BBGA package, making it a practical choice for designers needing on-board programmable logic without adding external components. Its commercial operating range, RoHS compliance, and standard surface-mount package support integration into volume consumer and commercial products.

This device is well suited for engineers developing moderate-complexity digital systems, prototypes, and interface-intensive applications that benefit from a programmable, compact FPGA solution with predictable power and thermal characteristics.

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