XC6SLX25T-2CSG324C

The XC6SLX25T-2CSG324C is a Spartan®-6 LXT field programmable gate array (FPGA) manufactured by AMD. It provides a balanced combination of logic capacity, embedded memory, and I/O in a compact 324‑LFBGA (15×15) package for surface-mount applications.

This device is suited for designs that require reconfigurable digital logic, moderate on-chip RAM, and a substantial number of I/O pins within a commercial temperature range.

Key Features

• Logic Resources — 24,051 logic elements to implement custom digital functions and state machines.
• Embedded Memory — Approximately 0.96 Mbits of on-chip RAM (958,464 total RAM bits) for buffering, FIFOs, and local data storage.
• I/O Capacity — 190 general-purpose I/O pins to interface with peripherals, sensors, and external devices.
• Package & Mounting — 324‑LFBGA (324‑CSPBGA, 15×15) package designed for surface-mount assembly to conserve board area.
• Power Supply — Core voltage range from 1.14 V to 1.26 V for integration into controlled power domains.
• Operating Range — Commercial temperature rating from 0 °C to 85 °C for standard ambient conditions.
• Environmental Compliance — RoHS compliant to support regulatory requirements for lead-free assembly.

Typical Applications

• Embedded Systems — Implement custom control logic and protocol bridging using the device's 24,051 logic elements and on-chip memory.
• High‑Density I/O Control — Drive and monitor multiple parallel interfaces or GPIOs leveraging 190 available I/Os.
• Prototyping and Development — Rapidly test and iterate digital designs that require reprogrammable logic and moderate embedded RAM.
• Consumer and Commercial Electronics — Integrate reconfigurable logic into compact, surface-mount products within a commercial temperature range.

Unique Advantages

• Substantial Logic Capacity: 24,051 logic elements enable implementation of complex finite-state machines, glue logic, and custom datapaths without external PLDs.
• On‑Chip Memory: Approximately 0.96 Mbits of embedded RAM reduces dependence on external memory for local buffering and temporary storage.
• High I/O Count: 190 I/Os provide flexibility for interfacing multiple peripherals, buses, and external devices from a single FPGA.
• Compact, Surface‑Mount Package: The 324‑LFBGA (15×15) package supports compact board layouts while maintaining a large number of signals.
• Commercial Temperature Rating: Rated 0 °C to 85 °C for standard commercial deployments.
• RoHS Compliant: Meets lead-free assembly requirements for modern manufacturing processes.

Why Choose XC6SLX25T-2CSG324C?

The XC6SLX25T-2CSG324C balances reconfigurable logic density, embedded RAM, and extensive I/O in a compact 324‑LFBGA footprint, making it appropriate for engineers who need a flexible FPGA for commercial applications. Its specified voltage and temperature ranges allow predictable integration into controlled power and thermal designs.

Backed by AMD as the manufacturer, this Spartan‑6 LXT device is targeted at designers seeking a programmable solution that consolidates multiple digital functions and reduces board-level complexity while maintaining compliance with RoHS requirements.

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