XC6SLX25-N3FG484C

IC FPGA 266 I/O 484FBGA
Part Description

Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 266 958464 24051 484-BBGA

Quantity 110 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O266Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1879Number of Logic Elements/Cells24051
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits958464

Overview of XC6SLX25-N3FG484C – Spartan®-6 LX FPGA, 484‑BBGA

The XC6SLX25-N3FG484C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD, packaged in a 484-BBGA surface-mount package. It delivers a balance of programmable logic capacity, embedded memory, and I/O density in a commercial-grade device.

Key device attributes include 24,051 logic elements, approximately 0.96 Mbits of on‑chip RAM, 266 I/O pins, a core supply range of 1.14 V to 1.26 V, and an operating temperature range of 0 °C to 85 °C.

Key Features

  • Core & Logic  Provides 24,051 logic elements to implement programmable digital logic functions and control logic on‑chip.
  • Embedded Memory  Approximately 0.96 Mbits of on‑chip RAM for buffering, state storage, and small lookup tables.
  • I/O Capacity  266 I/O pins to support multiple peripheral interfaces and board-level connectivity options.
  • Power  Core voltage supply range of 1.14 V to 1.26 V for system power planning and integration.
  • Package & Mounting  Surface-mount 484-BBGA package; supplier device package listed as 484-FBGA (23×23) for compact board layouts.
  • Temperature & Grade  Commercial grade operation from 0 °C to 85 °C for standard embedded and consumer environments.
  • Environmental Compliance  RoHS‑compliant to meet common environmental directives.

Unique Advantages

  • Significant logic capacity: 24,051 logic elements enable mid-range integration of custom digital functions without offloading to external devices.
  • On‑chip memory: Approximately 0.96 Mbits of embedded RAM supports buffering, FIFOs, and localized data storage to reduce external memory dependencies.
  • High I/O count: 266 I/O pins provide flexibility for interfacing multiple peripherals, sensors, and mezzanine connections.
  • Compact surface-mount package: 484-BBGA (484-FBGA, 23×23) supports dense PCB layouts while maintaining solderability for automated assembly.
  • Low-voltage core: 1.14 V–1.26 V supply range supports efficient power budgeting in modern system designs.
  • Standards-aware compliance: RoHS conformity and commercial temperature rating simplify regulatory and deployment planning for consumer and general-purpose products.

Why Choose XC6SLX25-N3FG484C?

The XC6SLX25-N3FG484C delivers a practical combination of programmable logic, embedded memory, and I/O density suitable for a wide range of embedded and consumer applications. Its 24,051 logic elements and approximately 0.96 Mbits of on‑chip RAM provide designers with the resources to implement complex control, signal processing, and glue-logic functions on a single device.

As an AMD Spartan®-6 LX FPGA in a compact 484‑BBGA surface-mount package, this device is positioned for designs that need mid-range integration, flexible I/O, and predictable commercial-grade operation, backed by a device manufacturer with established FPGA offerings.

Request a quote or submit an inquiry to receive pricing, availability, and technical support information for the XC6SLX25-N3FG484C.

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